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ICBAKE 2013 : 2013 International Conference on Biometrics and Kansei Engineering : 5-7 July 2013, Tokyo, Tokyo Metropolis, Japan / sponsored by IEEE, IEEE Computer Society.

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IEEE Xplore (IEEE/IET Electronic Library - IEL) Available online

IEEE Xplore (IEEE/IET Electronic Library - IEL)
Format:
Book
Conference/Event
Contributor:
IEEE Xplore (Online service)
IEEE Computer Society, sponsor.
Institute of Electrical and Electronics Engineers, sponsor.
Conference Name:
International Conference on Biometrics and Kansei Engineering (2013 : Toyko, Japan)
Language:
English
Subjects (All):
Consumer goods--Psychological aspects--Congresses.
Consumer goods.
New products--Congresses.
New products.
Design--Psychological aspects--Congresses.
Design.
Biometry--Congresses.
Biometry.
Image analysis--Congresses.
Image analysis.
Consumer goods--Psychological aspects.
Design--Psychological aspects.
Genre:
Conference papers and proceedings.
Physical Description:
1 online resource : illustrations
Other Title:
Available from some providers with title: Biometrics and Kansei Engineering (ICBAKE), 2013 International Conference on
2013 International Conference on Biometrics and Kansei Engineering (ICBAKE)
Place of Publication:
Piscataway, NJ : IEEE, 2013.
System Details:
text file
Notes:
IEEE Computer Society order number E5019.
Includes bibliographical references and author index.
Description based on online resource; title from PDF cover page (IEEE Xplore, viewed Jan. 27, 2015).
OCLC:
863087305
Access Restriction:
Restricted for use by site license.

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