My Account Log in

2 options

ICBAKE 2013 : 2013 International Conference on Biometrics and Kansei Engineering : 5-7 July 2013, Tokyo, Tokyo Metropolis, Japan / sponsored by IEEE, IEEE Computer Society.

Connect to full text Available online

View online

IEEE Xplore (IEEE/IET Electronic Library - IEL) Available online

View online
Format:
Book
Conference/Event
Contributor:
IEEE Xplore (Online service)
IEEE Computer Society, sponsor.
Institute of Electrical and Electronics Engineers, sponsor.
Conference Name:
International Conference on Biometrics and Kansei Engineering (2013 : Toyko, Japan)
Language:
English
Subjects (All):
Consumer goods--Psychological aspects--Congresses.
Consumer goods.
New products--Congresses.
New products.
Design--Psychological aspects--Congresses.
Design.
Biometry--Congresses.
Biometry.
Image analysis--Congresses.
Image analysis.
Consumer goods--Psychological aspects.
Design--Psychological aspects.
Genre:
Conference papers and proceedings.
Physical Description:
1 online resource : illustrations
Other Title:
Available from some providers with title: Biometrics and Kansei Engineering (ICBAKE), 2013 International Conference on
2013 International Conference on Biometrics and Kansei Engineering (ICBAKE)
Place of Publication:
Piscataway, NJ : IEEE, 2013.
System Details:
text file
Notes:
IEEE Computer Society order number E5019.
Includes bibliographical references and author index.
Description based on online resource; title from PDF cover page (IEEE Xplore, viewed Jan. 27, 2015).
OCLC:
863087305
Access Restriction:
Restricted for use by site license.

The Penn Libraries is committed to describing library materials using current, accurate, and responsible language. If you discover outdated or inaccurate language, please fill out this feedback form to report it and suggest alternative language.

Find

Home Release notes

My Account

Shelf Request an item Bookmarks Fines and fees Settings

Guides

Using the Find catalog Using Articles+ Using your account