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2012 7th International Microsystems, Packaging, Assembly, and Circuits Technology Conference : proceedings : October 24 (Wed)- 26 (Fri), 2012, Taipei Nangang Exhibition Center / organizer: IEEE [and 4 others].

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IEEE Xplore (IEEE/IET Electronic Library - IEL) Available online

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Format:
Book
Conference/Event
Contributor:
IEEE Xplore (Online service)
Institute of Electrical and Electronics Engineers, organizer.
Conference Name:
International Microsystems, Packaging, Assembly, and Circuits Technology Conference (7th : 2012 : Taipei, Taiwan)
Language:
English
Subjects (All):
Microelectromechanical systems--Congresses.
Microelectromechanical systems.
Microelectronic packaging--Congresses.
Microelectronic packaging.
Genre:
Conference papers and proceedings.
Physical Description:
1 online resource (various pagings) : illustrations
Other Title:
Microsystems, Packaging, Assembly, and Circuits Technology Conference
International Microsystems, Packaging, Assembly, and Circuits Technology Conference
IMPACT 2012
Seventh International Microsystems, Packaging, Assembly, and Circuits Technology Conference
7th International Microsystems, Packaging, Assembly, and Circuits Technology Conference
Available from some providers as: Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Place of Publication:
[Piscataway, N.J. : IEEE, 2012?]
System Details:
text file
Notes:
Description based on online resource; title from PDF of front cover, viewed Jan. 31, 2013.
IEEE Catalog Number: CFP1259B-ART.
Includes bibliographical references and author index.
OCLC:
835886779
Access Restriction:
Restricted for use by site license.

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