Proceedings, 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2012) : location, Guilin Bravo Hotel, Guilin, China : dates, Monday, Aug. 13 to Thursday, Aug. 16, 2012 / editors, Keyun Bi, Daoguo Yang, Miao Cai ; sponsored by Chinese Institute of Electonics, China, IEEE Component, Packaging, & Manufacturing Technology Society (IEEE-CPMT).

Format:

• Book
• Conference/Event

Contributor:

• Cai, Miao.
• Yang, Daoguo.
• Bi, Keyun.
• IEEE Xplore (Online service)
• Institute of Electrical and Electronics Engineers.
• Components, Packaging & Manufacturing Technology Society.
• Zhongguo dian zi xue hui.

Conference Name:

• International Conference on Electronic Packaging Technology & High Density Packaging (2012 : Guilin, China)

Language:

English

Subjects (All):

• Microelectronic packaging--Congresses.
• Microelectronic packaging.
• Electronic packaging--Congresses.
• Electronic packaging.
• Technology.

Local Subjects:

• Technology.

Genre:

• Conference papers and proceedings.

Physical Description:

1 online resource (various pagings) : illustrations

Other Title:

• 2012 International Conference on Electronic Packaging Technology & High Density Packaging
• ICEPT-HDP 2012
• 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging
• Available from some providers as: Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on

Place of Publication:

Piscataway, N.J. : IEEE, [2012]

System Details:

text file

Notes:

• "IEEE catalog number: CFP12553-USB."
• Description based on online resource; title from copyright page, viewed May 29, 2013.
• Includes bibliographical references and author index.

OCLC:

860759371

Access Restriction:

Restricted for use by site license.