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Proceedings, 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2012) : location, Guilin Bravo Hotel, Guilin, China : dates, Monday, Aug. 13 to Thursday, Aug. 16, 2012 / editors, Keyun Bi, Daoguo Yang, Miao Cai ; sponsored by Chinese Institute of Electonics, China, IEEE Component, Packaging, & Manufacturing Technology Society (IEEE-CPMT).
IEEE Xplore (IEEE/IET Electronic Library - IEL) Available online
IEEE Xplore (IEEE/IET Electronic Library - IEL)- Format:
- Book
- Conference/Event
- Conference Name:
- International Conference on Electronic Packaging Technology & High Density Packaging (2012 : Guilin, China)
- Language:
- English
- Subjects (All):
- Microelectronic packaging--Congresses.
- Microelectronic packaging.
- Electronic packaging--Congresses.
- Electronic packaging.
- Technology.
- Local Subjects:
- Technology.
- Genre:
- Conference papers and proceedings.
- Physical Description:
- 1 online resource (various pagings) : illustrations
- Other Title:
- 2012 International Conference on Electronic Packaging Technology & High Density Packaging
- ICEPT-HDP 2012
- 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging
- Available from some providers as: Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
- Place of Publication:
- Piscataway, N.J. : IEEE, [2012]
- System Details:
- text file
- Notes:
- "IEEE catalog number: CFP12553-USB."
- Description based on online resource; title from copyright page, viewed May 29, 2013.
- Includes bibliographical references and author index.
- OCLC:
- 860759371
- Access Restriction:
- Restricted for use by site license.
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