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2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2012) : December 9-11, 2012, Howard International House, Taipei.
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- Book
- Conference/Event
- Conference Name:
- Electrical Design of Advanced Packaging and Systems Symposium (2012 : Taipei, Taiwan)
- Language:
- English
- Subjects (All):
- Electronic packaging--Congresses.
- Electronic packaging.
- Microelectronic packaging--Congresses.
- Microelectronic packaging.
- Genre:
- Conference papers and proceedings.
- Physical Description:
- 1 online resource (various pagings) : illustrations (some color)
- Other Title:
- EDAPS 2012
- Available from some providers with title: Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE
- Place of Publication:
- Piscataway, NJ : IEEE, [2012]
- System Details:
- text file
- Notes:
- "IEEE Components, Packaging and Manufacturing Technology Society"-- PDF front cover (IEEE Xplore, viewed Sept. 26, 2013).
- IEEE Catalog Number: CFP12EDP-ART.
- Includes bibliographical references and author index.
- Description based on online resource; title from PDF title page (IEEE Xplore, viewed Sept. 26, 2013).
- OCLC:
- 839274748
- Access Restriction:
- Restricted for use by site license.
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