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2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference : October 18 - October 21, 2011, NTUH International Convention Center, Taipei, Taiwan.
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- Book
- Conference/Event
- Conference Name:
- International Microsystems, Packaging, Assembly, and Circuits Technology Conference (6th : 2011 : Taipei, Taiwan)
- Language:
- English
- Subjects (All):
- Microelectronic packaging--Congresses.
- Microelectronic packaging.
- Microelectromechanical systems--Congresses.
- Microelectromechanical systems.
- Electronic packaging--Congresses.
- Electronic packaging.
- Microelectronics--Congresses.
- Microelectronics.
- Genre:
- Conference papers and proceedings.
- Physical Description:
- 1 online resource (499 pages) : illustrations
- Other Title:
- Title from HTML contents page: Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International
- Also known as: IMPACT 2011 - Leading Innovation
- 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference
- Place of Publication:
- Piscataway, NJ : IEEE, 2011.
- System Details:
- text file
- Notes:
- "IEEE Catalog Number: CFP1159B-USB."
- Includes bibliographical references and index.
- Description based on online resource; title from PDF information page (IEEE Xplore, viewed Feb. 11, 2013).
- OCLC:
- 812661347
- Access Restriction:
- Restricted for use by site license.
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