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3D Systems Integration Conference (3DIC), 2011 IEEE International : date, Jan. 31 2012-Feb. 2 2012.

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IEEE Xplore (IEEE/IET Electronic Library - IEL) Available online

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Format:
Book
Conference/Event
Contributor:
IEEE Xplore (Online service)
Institute of Electrical and Electronics Engineers.
Conference Name:
IEEE International 3D Systems Integration Conference (2011 : Osaka, Japan)
Language:
English
Subjects (All):
Three-dimensional integrated circuits--Congresses.
Three-dimensional integrated circuits.
Integrated circuits--Design and construction--Congresses.
Integrated circuits.
Integrated circuits--Design and construction.
Three-dimensional imaging--Congresses.
Three-dimensional imaging.
Genre:
Conference papers and proceedings.
Physical Description:
1 online resource (various pagings) : illustrations
Other Title:
Also known as: 3DIC 2011
2011 IEEE International 3D Systems Integration Conference (3DIC)
Place of Publication:
[Piscataway, N.J.] : [IEEE], [2012]
System Details:
text file
Notes:
Conference held Jan. 31, 2012-Feb. 2, 2012; postponed from Oct. 2011.
Includes bibliographical references.
Title from HTML contents screen (IEEE Xplore, Dec. 4, 2012).
OCLC:
812608938
Access Restriction:
Restricted for use by site license.

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