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2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration : proceedings of 2012 3rd IEEE Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2012), May 22-23, 2012, The University of Tokyo, YAYOI Auditorium, Tokyo, Japan / editors: Tadatomo Suga, Hideki Takagi, Eiji Higurashi.
- Format:
- Book
- Conference/Event
- Conference Name:
- IEEE International Workshop on Low Temperature Bonding for 3D Integration (3rd : 2012 : Tokyo, Japan)
- Language:
- English
- Subjects (All):
- Sealing (Technology)--Congresses.
- Sealing (Technology).
- Three-dimensional integrated circuits--Congresses.
- Three-dimensional integrated circuits.
- Photonics--Materials--Congresses.
- Photonics.
- Photonics--Materials.
- Genre:
- Conference papers and proceedings.
- Physical Description:
- 1 online resource (various pagings) : illustrations
- Other Title:
- Title from HTML contents page: Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
- Low Temperature Bonding for 3D Integration
- LTB-3D 2012
- Place of Publication:
- Piscataway, NJ : IEEE, 2012.
- System Details:
- text file
- Notes:
- Title from PDF title page (IEEE Xplore, viewed Jan. 28, 2013).
- "IEEE Catalog Number: CFP1218S-ART."
- Includes bibliographical references.
- OCLC:
- 812607987
- Access Restriction:
- Restricted for use by site license.
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