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DTIP 2012 : Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS : 25-26-27 April 2012, Cannes, Cote d'Azur, France.
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- Book
- Conference/Event
- Conference Name:
- Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS (2012 : Cannes, France)
- Language:
- English
- Subjects (All):
- Microelectromechanical systems--Congresses.
- Microelectromechanical systems.
- Optoelectronic devices--Congresses.
- Optoelectronic devices.
- Micromachining--Congresses.
- Micromachining.
- Microelectronic packaging--Congresses.
- Microelectronic packaging.
- Genre:
- Conference papers and proceedings.
- Physical Description:
- 1 online resource (xi, 259 pages) : illustrations
- Other Title:
- Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
- Title from HTML contents page: Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2012 Symposium on
- 2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
- Place of Publication:
- [Piscataway, N.J.] : [IEEE], [2012]
- System Details:
- text file
- Notes:
- Joint meeting of CAD, Design and Test Conference and Microfabrication, Integration and Packaging Conference.
- Description based on online resource; title from PDF front cover (IEEE Xplore, viewed Feb. 4, 2013).
- Includes bibliographical references and author index.
- OCLC:
- 812607842
- Access Restriction:
- Restricted for use by site license.
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