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Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2011 IEEE / [sponsored by Components, Packaging and Manufacturing Technology Society].
IEEE Xplore (IEEE/IET Electronic Library - IEL) Available online
IEEE Xplore (IEEE/IET Electronic Library - IEL)- Format:
- Book
- Conference/Event
- Conference Name:
- Electrical Design of Advanced Packaging and Systems Symposium (2011 : Hanzhou, China)
- Language:
- English
- Subjects (All):
- Electronic packaging--Congresses.
- Electronic packaging.
- Microelectronic packaging--Congresses.
- Microelectronic packaging.
- Genre:
- Conference papers and proceedings.
- Physical Description:
- 1 online resource (various pagings) : illustrations (some color)
- Other Title:
- 2011 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)
- Also known as: EDAPS 2011
- Place of Publication:
- [Piscataway, N.J.] : [IEEE], [2011]
- System Details:
- text file
- Notes:
- Conference venue and sponsorship statement taken from IEEE Conferences & Events webpage.
- Includes bibliographical references.
- Description based on online resource; title from title screen (IEEE Xplore, viewed Aug. 9, 2012).
- ISBN:
- 9781467322898
- 146732289X
- OCLC:
- 805582260
- Access Restriction:
- Restricted for use by site license.
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