2010 IEEE 16th International Symposium for Design and Technology of Electronics Packages (SIITME) : 23-26 Sep 2010, Pitesti, Romania / organizers, University of Pitesti, "Politehnica" University of Bucharest ; [technically sponsored by IEEE CPMT Society].

Format:

Book

Conference/Event

Contributor:

IEEE Xplore (Online service)

Institute of Electrical and Electronics Engineers.

Components, Packaging & Manufacturing Technology Society.

Conference Name:

International Symposium for Design and Technology of Electronics Packages (16th : 2010 : Pitești, Romania)

Language:

English

Subjects (All):

Electronic packaging--Congresses.

Electronic packaging.

Genre:

Conference papers and proceedings.

Physical Description:

1 online resource (xx, 334 pages) : illustrations (some color)

Other Title:

Available from some providers with title: Design and Technology in Electronic Packaging (SIITME), 2010 IEEE 16th International Symposium for

Also known as: SIITME 2010

2010 IEEE Sixteenth International Symposium for Design and Technology of Electronics Packages (SIITME)

IEEE 16th International Symposium for Design and Technology of Electronics Packages (SIITME)

Place of Publication:

Piscataway, N.J. : IEEE, [2010]

System Details:

text file

Notes:

Title from PDF title page screen (IEEE Xplore, viewed June 17, 2011).

"IEEE Catalog Number: CFP1007I-ART."

Includes bibliographical references and index.

OCLC:

731210791

Access Restriction:

Restricted for use by site license.