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Proceedings, 2010 International Conference on Electronic Packaging Technology & High Density Packaging : (ICEPT-HDP 2010) ; location, Tang Cheng Hotel, Xi'an, China ; dates, Monday, Aug 16 to Thursday, Aug 19, 2010 / directed by Chinese Institute of Electronics ... [and others] ; sponsored by Electronic Manufacturing & Packaging Technology Society of the Chinese Institute of Electronics, IEEE Component, Packaging, & Manufacturing Technology Society (IEEE-CPMT), Xidian University ; organized by Electronic Manufacturing & Packaging Technology Society of the Chinese Institute of Electronics, Xidian University, Beijing Faith Consulting Co., Ltd. ; editors Keyun Bi, Yintang Yang, Gang Dong.

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Format:
Book
Conference/Event
Contributor:
Bi, Keyun.
Yang, Yintang.
Dong, Gang.
IEEE Xplore (Online service)
Zhongguo dian zi xue hui.
China Electronic Packaging Society.
Qing hua da xue (Beijing, China)
Xi'an dian zi ke ji da xue.
Components, Packaging & Manufacturing Technology Society.
Conference Name:
International Conference on Electronic Packaging Technology & High Density Packaging (2010 : Xi'an, China)
Language:
English
Subjects (All):
Electronic packaging--Congresses.
Electronic packaging.
Microelectronic packaging--Congresses.
Microelectronic packaging.
Ebooks--UML.
Local Subjects:
Ebooks--UML.
Genre:
Conference papers and proceedings.
Physical Description:
1 online resource : illustrations
Other Title:
ICEPT-HDP 2010
2010 International Conference on Electronic Packaging Technology & High Density Packaging
Electronic Packaging Technology & High Density Packaging
International Conference on Electronic Packaging Technology & High Density Packaging
Electronic Packaging Technology and High Density Packaging
ICEPT-HDP '10
Available from some providers with title: Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging
Place of Publication:
Piscataway, N.J. : IEEE, [2010]
System Details:
text file
Notes:
Title from PDF t.p. (IEEE Xplore, viewed Mar. 25, 2011).
IEEE Catalog Number: CFP10553-ART.
Includes bibliographical references and index.
OCLC:
708651552
Access Restriction:
Restricted for use by site license.

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