EuroSimE 2009 : 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2009 : 26-29 April, 2009, [Delft, the Netherlands / organized by Components, Packaging & Manufacturing Technology Society ; sponsored by the Delft University of Technology ... and others].

Format:

Book

Conference/Event

Contributor:

IEEE Xplore (Online service)

Technische Universiteit Delft.

Components, Packaging & Manufacturing Technology Society.

Conference Name:

EuroSimE (2009 : Delft, Netherlands)

Language:

English

Subjects (All):

Microelectromechanical systems--Congresses.

Microelectromechanical systems.

Microelectronic packaging--Congresses.

Microelectronic packaging.

Semiconductors--Mechanical properties--Congresses.

Semiconductors.

Semiconductors--Thermal properties--Congresses.

Integrated circuits--Simulation methods--Congresses.

Integrated circuits.

Microelectronics--Design--Congresses.

Microelectronics.

Microelectronics--Simulation methods--Congresses.

Microelectronics--Simulation methods.

Microelectronics--Design.

Integrated circuits--Simulation methods.

Semiconductors--Thermal properties.

Genre:

Conference papers and proceedings.

Physical Description:

1 online resource : illustrations

Other Title:

Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Micro-Systems, 2009

10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009

Available from some providers with title: Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009, EuroSimE 2009, 10th International Conference on

Place of Publication:

[Piscataway, N.J.] : IEEE, [2009]

System Details:

text file

Notes:

Title from HTML home page (viewed June 23, 2009).

Includes bibliographical references.

OCLC:

613544307

Access Restriction:

Restricted for use by site license.