2 options
2009 Electrical Design of Advanced Packaging and Systems Symposium : IEEE EDAPS 2009 : December 2-4, 2009, Shatin, Hong Kong / sponsor, IEEE Components, Packaging, and Manufacturing Technology Society (CPMT) ; technical sponsor: Chinese University of Hong Kong - CUHK.
- Format:
- Book
- Conference/Event
- Conference Name:
- Electrical Design of Advanced Packaging and Systems Symposium (2009 : Shatin, Hong Kong, China)
- Language:
- English
- Subjects (All):
- Electronic packaging--Congresses.
- Electronic packaging.
- Microelectronic packaging--Congresses.
- Microelectronic packaging.
- Genre:
- Conference papers and proceedings.
- Physical Description:
- 1 online resource : illustrations
- Other Title:
- EDAPS 2009
- IEEE EDAPS
- Electrical Design of Advanced Packaging and Systems Symposium
- Available from some providers with title: Electrical Design of Advanced Packaging & Systems Symposium, 2009. (EDAPS 2009). IEEE
- IEEE Electrical Design of Advanced Packaging & Systems Symposium, 2009
- Place of Publication:
- [Piscataway, N.J.] : IEEE, [2009]
- System Details:
- text file
- Notes:
- Title from title screen, (IEEE Xplore, viewed Feb. 4, 2010).
- Includes bibliographical references.
- OCLC:
- 613538602
- Access Restriction:
- Restricted for use by site license.
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