2 options
3D System Integration, 2009. 3DIC 2009. IEEE International Conference on.
Connect to full text Available online
View online- Format:
- Book
- Conference/Event
- Conference Name:
- IEEE International 3D Systems Integration Conference (2009 : San Francisco, Calif.)
- Language:
- English
- Subjects (All):
- Integrated circuits--Congresses.
- Integrated circuits.
- Integrated circuits--Design and construction--Congresses.
- Integrated circuits--Design and construction.
- Semiconductor wafers--Congresses.
- Semiconductor wafers.
- Three-dimensional imaging--Congresses.
- Three-dimensional imaging.
- Genre:
- Conference papers and proceedings.
- Physical Description:
- 1 online resource : illustrations
- Other Title:
- 3DIC
- Place of Publication:
- [Piscataway, N.J.] : IEEE, [2009]
- System Details:
- text file
- Notes:
- Title from IEEE summary page (IEEE Xplore, viewed on Nov. 25, 2009).
- "Date: 28-30 Sept. 2009."
- Includes bibliographical references and author index.
- ISBN:
- 9781424445127
- 1424445124
- OCLC:
- 470323195
- Access Restriction:
- Restricted for use by site license.
The Penn Libraries is committed to describing library materials using current, accurate, and responsible language. If you discover outdated or inaccurate language, please fill out this feedback form to report it and suggest alternative language.