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Practical guide to RF-MEMS / Jacopo Iannacci.

Van Pelt Library TK7875 .I26 2013
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Format:
Book
Author/Creator:
Iannacci, Jacopo, author.
Language:
English
Subjects (All):
Radio frequency microelectromechanical systems.
Physical Description:
xvi, 344 pages : illustrations (chiefly colour) ; 25 cm
Edition:
First edition.
Place of Publication:
Weinheim, Germany : Wiley-VCH Verlag GmbH & Co. KGaA, 2013.
Summary:
Providing researchers and engineers with invaluable practical hints on how to develop novel RF-MEMS device concepts, this book deals with modeling, design, simulation, optimization, fabrication and characterization of MEMS for radio-frequency applications. To begin with, prototypical RF-MEMS devices, including lumped components and complex networks, are presented as reference examples, and these are then discussed from different perspectives with regard to design, simulation, packaging, testing, and post-fabrication modeling. The text explicitly treats the hard-to-predict interplay between the three-dimensional device structure and its electromagnetic functionality. Theoretical concepts are introduced when necessary to complement the practical hints given for all RF-MEMS development stages, and simulation results are validated against experimental results. With its design and simulation examples based on such widely-known software packages as ANSYS and the hardware description language Verilog, this guide will appeal to the practice-oriented R&D reader. Book jacket.
Contents:
1 RF-MEMS Applications and the State of the Art 1
1.1 Introduction 7
1.2 A Brief History of MEMS and RF-MEMS from the Perspective of Technology 2
1.3 RF-MEMS Lumped Components 3
1.3.1 Variable Capacitors 4
1.3.2 Inductors 10
1.3.3 Ohmic and Capacitive Switches 12
1.4 RF-MEMS Complex Networks 20
1.4.1 Reconfigurable Impedance-Matching Networks 20
1.4.2 Reconfigurable RF Power Attenuators 23
1.4.3 Reconfigurable Phase Shifters and Delay Lines 26
1.4.4 Reconfigurable Switching Matrices 26
1.5 Modeling and Simulation of RF-MEMS Devices 28
1.5.1 The Finite Element Method Approach 28
1.5.2 Compact Modeling of RF-MEMS 28
1.5.3 Mixed-Domain Electromechanical Simulation Environment- 30
1.6 Packaging of RF-MEMS 31
1.7 Brief Overview of Exploitation of RF-MEMS in RF Systems 33
1.8 Conclusions 38
2 The Book in Brief 41
2.1 Introduction 41
2.2 A Brief Introduction to the FBK RF-MEMS Technology 42
2.3 An RF-MEMS Series Ohmic Switch (Dev A) 44
2.4 RF-MEMS Capacitive Switches/Varactors 49
2.4.1 Design 1 (Dev B1) 49
2.4.2 Design 2 (Dev B2) 50
2.4.3 RF-MEMS Ohmic Switch with Microheaters (Dev C) 50
2.4.4 MEMS-Based Reconfigurable RF Power Attenuator (Dev D) 52
2.4.5 MEMS-Based Reconfigurable Impedance-Matching Network (Dev E) 55
2.5 Conclusions 55
3 Design 57
3.1 Introduction 57
3.2 Design Rules of the Fondazione Bruno Kessler RF-MEMS Technology 58
3.3 Design of an RF-MEMS Series Ohmic Switch (Dev A) 60
3.4 Generation of 3D Models Starting from the 2D Layout 77
3.5 Conclusions 83
4 Simulation Techniques (Commercial Tools) 85
4.1 Introduction 85
4.2 Static Coupled Electromechanical Simulation of the RF-MEMS Ohmic Switch (Dev A) in ANSYS Multiphysics™ 86
4.2.1 Block 1: Definition of the Geometry and Properties of the Material 88
4.2.2 Block 2: Meshing of the Structure 92
4.2.3 Block 3: Generation of the Elements for the Electromechanical Coupling 93
4.2.4 Block 4: Definition of the Mechanical Boundary Conditions 95
4.2.5 Block 5: Definition of the Simulation 97
4.2.6 Block 6: Simulation Execution 99
4.2.7 Block 7: Postprocessing and Visualization of Results 99
4.3 Modal Analysis of the RF-MEMS Capacitive Switch (Dev B2) in ANSYS Multiphysics 101
4.4 Coupled Thermoelectromechanical Simulation of the RF-MEMS Ohmic Switch with Microheaters (Dev C) in ANSYS Multiphysics 104
4.5 RF Simulation (S-parameters) of the RF-MEMS Variable Capacitor (Dev B1) in ANSYS HFSS™ 121
4.6 Conclusions 130
5 On-Purpose Simulation Tools 133
5.1 Introduction 133
5.2 MEMS Compact Model Library 134
5.2.1 Suspended Rigid Plate Electromechanical Transducer 134
5.2.2 Flexible Beam 140
5.2.3 Simulation Validation of a MEMS Toggle Switch 144
5.3 A Hybrid RF-MEMS/CMOS VCO 149
5.4 Excerpts of Verilog-A Code Implemented for MEMS Models 151
5.4.1 Anchor Point 152
5.4.2 Force Source 154
5.4.3 Flexible Beam 157
5.5 Conclusions 165
6 Packaging and Integration 167
6.1 Introduction 167
6.2 A WLP Solution for RF-MEMS Devices and Networks 168
6.2.1 Package Fabrication Process 169
6.2.2 Wafer-to-Wafer Bonding Solutions 173
6.3 Encapsulation of RF-MEMS Devices 177
6.3.1 The Issue of Wafer-to-Wafer Alignment 178
6.3.2 Hybrid Packaging Solutions for RF-MEMS Devices 180
6.4 Fabrication Run of Packaged Test Structures 181
6.5 Electromagnetic Characterization of the Package 185
6.5.1 Validation of the S-parameter Simulations of Packaged Test Structures 186
6.5.2 Parameterized S-parameter Simulation of Packaged Test Structures 187
6.6 Influence of Uncompressed ACA on the RF Performance of Capped MEMS Devices 191
6.7 Conclusions 194
7 Postfabrication Modeling and Simulations 195
7.1 Introduction 195
7.2 Electromechanical Simulation of an RF-MEMS Varactor (Dev B2) with Compact Models 196
7.3 RF Modeling of an RF-MEMS Varactor (Dev B2) with a Lumped Element Network 202
7.4 Electromechanical Modeling of an RF-MEMS Series Ohmic Switch (Dev A) with Compact Models 213
7.5 Electromagnetic Modeling and Simulation of an RF-MEMS Impedance-Matching Network (Dev E) for a GSM CMOS Power Amplifier 218
7.5.1 Introduction 219
7.5.2 Electromagnetic Design and Optimization of the RF-MEMS Impedance-Matching Network 219
7.5.3 Deign of a Reconfigurable Class E PA 224
7.5.4 Experimental Results for the Hybrid RF-M EMS/CMOS PA 227
7.6 Electromagnetic Simulation of an RF-MFMS Capacitive Switch (Dev B1) in ANSYS HFSS™ 229
7.7 Electromagnetic Simulation of a MEMS-Based Reconfigurable RF Power Attenuator (Dev D) in ANSYS HFSS 234
7.8 Conclusions 238.
Notes:
Includes bibliographical references (pages 317-329) and index.
ISBN:
9783527335640
3527335641
OCLC:
864949128

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