Electronic thin film reliability / King-Ning Tu.

Format:

Book

Author/Creator:

Tu, K. N. (King-Ning), 1937-2025

Contributor:

Christine Hikawa Fund.

Language:

English

Subjects (All):

Thin films--Textbooks.

Thin films.

Reliability (Engineering)--Textbooks.

Reliability (Engineering).

Genre:

Textbooks.

Physical Description:

xvi, 396 pages : illustrations ; 26 cm

Place of Publication:

Cambridge ; New York : Cambridge University Press, 2011.

Summary:

"Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners"-- Provided by publisher.

Contents:

Thin-film applications to microelectronic technology

Thin-film deposition

Surface energies

Atomic diffusion in solids

Applications of the diffusion equation

Elastic stress and strain in thin films

Surface kinetic processes on thin films

Interdiffusion and reaction in thin films

Grain-boundary diffusion

Irreversible processes in interconnect and packaging technology

Electromigration in metals

Electromigration-induced failure in Al and Cu interconnects

Thermomigration

Stress migration in thin films

Reliability science and analysis

Appendices: A. A brief review of thermodynamic functions; B. Defect concentration in solids; C. Derivation of Huntington's electron wind force; D. Elastic constants tables and conversions; E. Terrace size distribution in Si MBE; F. Interdiffusion coefficient; G. Tables of physical properties.

Notes:

Includes bibliographical references and index.

Local Notes:

Acquired for the Penn Libraries with assistance from the Christine Hikawa Fund.

ISBN:

0521516137

9780521516136

OCLC:

607986413

Publisher Number:

99949592590