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Thermomechanical couplings in solids : Jean Mandel memorial symposium, Paris France, 1-5 September, 1986 / edited by H.D. Bui and Q.S. Nguyen.

LIBRA TA418.58 .T46 1987
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Format:
Book
Conference/Event
Contributor:
Mandel, Jean.
Bui, Huy Duong.
Nguyen, Quoc Son.
International Union of Theoretical and Applied Mechanics.
Conference Name:
I.U.T.A.M. Symposium on "Thermomechanical Couplings in Solids" (1986 : Paris, France)
Language:
English
Subjects (All):
Thermal stresses--Congresses.
Thermal stresses.
Thermoelasticity--Congresses.
Thermoelasticity.
Coupled problems (Complex systems)--Congresses.
Coupled problems (Complex systems).
Materials--Testing--Congresses.
Materials.
Materials--Testing.
Genre:
Conference papers and proceedings.
Physical Description:
xiii, 425 pages : illustrations ; 24 cm
Place of Publication:
Amsterdam ; New York : North-Holland ; New York, N.Y., U.S.A. : Sole distributors for the U.S.A. and Canada, Elsevier Science Pub. Co., 1987.
Notes:
Lectures presented at the I.U.T.A.M. Symposium on "Thermomechanical Couplings in Solids," held in Paris, Sept. 1986.
Includes bibliographies.
ISBN:
0444702369
OCLC:
15520608

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