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Modeling and simulation for microelectronic packaging assembly : manufacture, reliability, and testing / Sheng Liu, Yong Liu.
- Format:
- Book
- Author/Creator:
- Liu, S. (Sheng), 1963-
- Language:
- English
- Subjects (All):
- Microelectronic packaging--Simulation methods.
- Microelectronic packaging.
- Simulation methods.
- Physical Description:
- 1 online resource (xxi, 564 pages) : illustrations (some color)
- polychrome
- Place of Publication:
- Hoboken, N.J. : Wiley, 2011.
- System Details:
- text file
- Contents:
- Front Matter
- Mechanics and Modeling. Constitutive Models and Finite Element Method
- Material and Structural Testing for Small Samples
- Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution
- Accelerated Fatigue Life Assessment Approaches for Solders in Packages
- Multi-Physics and Multi-Scale Modeling
- Modeling Validation Tools
- Application of Fracture Mechanics
- Concurrent Engineering for Microelectronics
- Modeling in Microelectronic Packaging and Assembly. Typical IC Packaging and Assembly Processes
- Opto Packaging and Assembly
- MEMS and MEMS Package Assembly
- System in Package (SIP) Assembly
- Modeling in Microelectronic Package Reliability and Test. Wafer Probing Test
- Power and Thermal Cycling, Solder Joint Fatigue Life
- Passivation Crack Avoidance
- Drop Test
- Electromigration
- Popcorning in Plastic Packages
- Modern Modeling and Simulation Methodologies: Application to Nano Packaging. Classical Molecular Dynamics
- Index.
- Notes:
- Includes bibliographical references and index.
- Electronic reproduction. Hoboken, N.J. Available via World Wide Web.
- Local Notes:
- Acquired for the Penn Libraries with assistance from the Hazel M. Hussong Fund.
- Other Format:
- Print version: Liu, S. (Sheng), 1963- Modeling and simulation for microelectronic packaging assembly.
- ISBN:
- 9780470827826
- 0470827823
- Publisher Number:
- 99947592026
- Access Restriction:
- Restricted for use by site license.
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