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Three-dimensional integrated circuit design : EDA, design and microarchitectures / Yuan Xie, Jason Cong, Sachin Sapatnekar.
LIBRA TK7874 .T47 2010
Available from offsite location
- Format:
- Book
- Series:
- Series on integrated circuits and systems
- Integrated circuits and systems
- Language:
- English
- Subjects (All):
- Integrated circuits--Design and construction.
- Integrated circuits.
- Physical Description:
- xii, 284 pages : illustrations ; 25 cm.
- Other Title:
- 3-D integrated circuit design
- Place of Publication:
- New York : Springer Verlag, 2010.
- Summary:
- This book presents an overview of the field of 3D IC design, with an emphasis on electronic design automation (EDA) tools and algorithms that can enable the adoption of 3D ICs, and the architectural implementation and potential for future 3D system design. The aim of this book is to provide the reader within a complete understanding of:
- the promise of 3D ICs in building novel systems that enable the chip industry to continue along the path of performances scaling
- the state of the art in fabrication technologies for 3D integration
- the most prominent 3D-specific EDA challenges, along with solutions and best practices
- the architectural benefits of using 3D technology
- architectural-and system-level design issues, and
- the cost implications of 3D IC design
- Three-Dimensional Integrated Circuit Design: EDA, Design and Microachitectures is intended for practitioners in the field, researchers and graduate students seeking to know more about 3D IC design.
- Contents:
- 1 Introduction / Kerry Bernstein 1
- 2 3D Process Technology Considerations / Albert M. Young, Steven J. Koester 15
- 3 Thermal and Power Delivery Challenges in 3D ICs / Pulkit Jain, Pingqiang Zhou, Chris H. Kim, Sachin S. Sapatnekar 33
- 4 Thermal-Aware 3D Floorplan / Jason Cong, Yuchun Ma 63
- 5 Thermal-Aware 3D Placement / Jason Cong, Guojie Luo 103
- 6 Thermal Via Insertion and Thermally Aware Routing in 3D ICs / Sachin S. Sapatnekar 145
- 7 Three-Dimensional Microprocessor Design / Gabriel H. Loh 161
- 8 Three-Dimensional Network-on-Chip Architecture / Yuan Xie, Narayanan Vijaykrishnan, Chita Das 189
- 9 PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers / Taeho Kgil, David Roberts, Trevor Mudge 219
- 10 System-Level 3D IC Cost Analysis and Design Exploration / Xiangyu Dong, Yuan Xie 261.
- Notes:
- Includes bibliographical references and index.
- ISBN:
- 9781441907837
- 1441907831
- 9781441907844
- 144190784X
- OCLC:
- 401159434
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