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Proceedings of 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06). June 27th-June 30 2006 : Shanghai University, Shanghai, China / organized by IEEE ... [and others].
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View online- Format:
- Book
- Conference/Event
- Conference Name:
- IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (8th : 2006 : Shanghai, China)
- Language:
- English
- Subjects (All):
- Integrated circuits--Design and construction--Congresses.
- Integrated circuits.
- Integrated circuits--Design and construction.
- Electronic packaging--Congresses.
- Electronic packaging.
- Microelectromechanical systems--Congresses.
- Microelectromechanical systems.
- Genre:
- Conference papers and proceedings.
- Physical Description:
- 328 pages : illustrations
- Other Title:
- 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06)
- Proceedings, HDP '06
- Place of Publication:
- Piscataway, NJ : IEEE, 2006.
- System Details:
- Mode of access: World Wide Web.
- text file
- Notes:
- "IEEE catalog number 06EX1427"--T.p. verso.
- Includes bibliographical references and index.
- ISBN:
- 1424404886
- 9781424404889
- 1424404894
- 9781424404896
- OCLC:
- 76171450
- Access Restriction:
- Restricted for use by site license.
- Online:
- Table of contents only
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