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2005 10th International Symposium on Advanced Packaging Materials. processes, properties and interfaces : March 16-18, 2005, Irvine, CA.

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IEEE Xplore (IEEE/IET Electronic Library - IEL) Available online

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Format:
Book
Conference/Event
Contributor:
IEEE Xplore (Online service)
Conference Name:
International Symposium on Advanced Packaging Materials (10th : 2005 : Irvine, Calif.)
Language:
English
Subjects (All):
Electronic packaging--Materials--Congresses.
Electronic packaging.
Electronic packaging--Materials.
Genre:
Conference papers and proceedings.
Physical Description:
viii, 302 pages : illustrations
Other Title:
Advanced packaging materials
Advanced Packaging Materials: Processes, Properties and Interfaces, 2005, proceedings, International Symposium on.
Place of Publication:
[New York, N.Y.] : Institute of Electrical and Electronics Engineers, [2005]
System Details:
Mode of access: World Wide Web.
text file
Notes:
Includes bibliographical references and index.
ISBN:
0780390857
9780780390850
OCLC:
60850347
Access Restriction:
Restricted for use by site license.

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