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Proceedings of the 4th International Symposium on Electronic Materials and Packaging. December 4-6, 2002, Kaosiung, Taiwan / organized by I-Shou University in collaboration with IEEE Component, Packaging, and Manufacturing Technology, Taipei Chapter.
- Format:
- Book
- Conference/Event
- Conference Name:
- International Symposium on Electronic Materials and Packaging (4th : 2002 : Kao-hsiung hsien, Taiwan)
- Language:
- English
- Subjects (All):
- Electronics--Materials--Congresses.
- Electronics.
- Electronics--Materials.
- Electronic packaging--Congresses.
- Electronic packaging.
- Genre:
- Conference papers and proceedings.
- Physical Description:
- xv, 498 pages : illustrations
- Other Title:
- Proceedings of International Symposium on Electronic Materials and Packaging
- EMAP 2002
- Proceedings, International Symposium on Electronic Materials and Packaging
- Place of Publication:
- Piscataway, NJ : IEEE, [2002]
- System Details:
- Mode of access: World Wide Web.
- text file
- Notes:
- "IEEE catalog number 02EX634"--T.p. verso.
- Includes bibliographical references.
- ISBN:
- 078037682X
- 9780780376823
- OCLC:
- 51952656
- Access Restriction:
- Restricted for use by site license.
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