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International Symposium on Electronic Materials and Packaging. (EMAP2000) : November 30-December 2, 2000, Hong Kong / organized by Hong Kong University of Science and Technology Department of Mechanical Engineering & EPACK LAB ; in collaboration with Institute of Electrical and Electronics Engineres, IEEE Component, Packaging & Manufacturing Technology, Hong Kong Chapter.
- Format:
- Book
- Conference/Event
- Conference Name:
- International Symposium on Electronic Materials and Packaging (2000 : Hong Kong, China)
- Language:
- English
- Subjects (All):
- Electronic packaging--Congresses.
- Electronic packaging.
- Genre:
- Conference papers and proceedings.
- Physical Description:
- xii, 475 pages, 3 unnumbered pages : illustrations
- Other Title:
- EMAP2000
- Electronic materials and packaging
- Electronic Materials and Packaging, 2000, (EMAP 2000), International Symposium on.
- Place of Publication:
- Piscataway, N.J. : IEEE, [2000]
- System Details:
- Mode of access: World Wide Web.
- text file
- Notes:
- Includes advertising material.
- Includes bibliographical references.
- ISBN:
- 0780366549
- 9780780366541
- OCLC:
- 46342922
- Access Restriction:
- Restricted for use by site license.
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