4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. proceedings presented at Adhesives in Electronics 2000, Espoo, Finland, June 18-21, 2000 / proceedings editor, Marika Hyytiäinen.

Format:

Book

Conference/Event

Contributor:

Hyytiäinen, Marika.

IEEE Xplore (Online service)

Nokia (Firm)

Conference Name:

International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (4th : 2000 : Espoo, Finland)

Language:

English

Subjects (All):

Electronic packaging--Congresses.

Electronic packaging.

Adhesive joints--Congresses.

Adhesive joints.

Coating processes--Congresses.

Coating processes.

Multichip modules (Microelectronics)--Design and construction--Congresses.

Multichip modules (Microelectronics).

Multichip modules (Microelectronics)--Design and construction.

Genre:

Conference papers and proceedings.

Physical Description:

xii, 319 pages : illustrations

Other Title:

Forth International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing

Place of Publication:

Piscataway, NJ : IEEE, [2000]

System Details:

Mode of access: World Wide Web.

text file

Contents:

ACA Bonding Technology for Low Cost Electronics Packaging Applications - Current Status and Remaining Challenges / Johan Liu 1

Novel Applications

The Concepts for Ultra Thin Packaging Technologies / Aschenbrenner R., Ansorge, F., Feil, M., Landesberger, Ch., Jung, E., Ostmann, A., Reichl, H. 16

Assembly of ultra thin and flexible ICs / Adler, C., Klink, G., Feil, M., Ansorge, F., Reichl, H. 20

Modeling Stresses in Ultra-Thin Flip Chips / Marjamaki, P., Kivilahti, J., Reinikainen, T. 24

Adhesion & Interfacial Properties I

Role of Adhesion and its Reliability Implications in Electronic Assemblies / Puligandla, V. 28

Adhesion Studies for Flip-Chip Assemblies / Pearson, R.A. 35

Investigations of Plasma Cleaning on the Reliability of Electrically Conductive Adhesives / Probsthain S., Morris J. 41

Interconnection technologies for Smart Cards

Evaluation of Flip Chip Bonding Using ACA on Polyester Substrates / Miessner, R., Nieland C., Aschenbrenner, R., Reichl, H. 46

Smart Cards and Smart Labels - High Volume Applications of Adhesive Flip - Chip Technologies / Seidowski, Th., Kriebel, F., Galties, J. 52

Development of High-Density Interconnection Techniques for Contactless Smart Cards / Aintila, A., Sarkka, J., Kivilahti, J. 55

Adhesion & Interfacial Properties II

Delamination Analysis of Electronic Package Assemblies with Insulated Metal Substrate / Hauck, T., Mercado L., Sarihan, V. 56

Effect of Black Copper Oxide on Interface Adhesion Between Copper Substrate & Glob-Top Resin / Lebbai, M., Kim, J.K., Yuen, M.M.F., Tong, P. 61

Adhesion Performance and Thermo-Mechanical Property of Epoxy-based Underfill / Luo S., Yamashita, T., Wong, C.P 70

Reliability I

Analyses of Flip Chip Attach Reliability / Dudek, R., Schubert, A., Michel, B. 77

Guidelines to Select Underfills for Flip Chip on Board Assemblies / Okura, J., Reinikainen, T., Dasgupta, A., Caers, J.F.J.M. 86

Reliability of Flip Chip Die Attach in Multichip Mechatronic Power Module / Paulasto, M., Hauck, T., Kolbeck, A. 93

Reliability of ACF in Flip-Chip with Various Bump Height / Wu, C.M.L., Yeung, N.H., Liu, J. 101

Materials Development: Design & Modeling I

One-Part Fast Cure Chipbonder Epoxy Adhesives for Electronic Applications / Figovsky, O, Sklyarsky, L., Sklyarsky, O. 107

Development of Solder Replacement Conductive Adhesives with Stable Resistance and Superior Impact Performance / Lu D., Wong, C.P. 110

Modeling of Branched Crosslinked Composites, Using the Statistical Polymer Method / Figovsky, O., Romm, F., Karchevsky, V. 117

Electrically Conductive Polyaniline Adhesive / Pietila, M., Makela, T., Isotalo, H., Levon, K., Kivilahti, J. 118

Recent Advances on Electrically Conductive Adhesives for Electronics Applications / C.P. Wong, Lu, D. 121

Processing & Interconnection technologies I

Flip Chip technologies with Adhesives, Possibilities and Challenges / Jagt, J.

Anisotropic Conductive Adhesive Films for Flip Chip On Flex Packages / Li, L., Fang, T. 129

Performance of the Stud Bump Bonding (SBB) Process in Comparison to Solder Flip Chip Technology / Reinert, W., Harder, T. 136

ACA Performance

Degradation Mechanisms of Anisotropic Conductive Adhesive Joints for Flip Chip on Flex Applications / Y.C. Chan, K.C. Hung, C.W. Tang, C.M.L. Wu 141

Bismuth-filled Anisotropically Conductive Adhesive for Flip Chip Bonding / Vuorela, M., Kivilahti, J., Holloway, M., Fuchs, S., Stam, F. 147

Anisotropic Conductive Film (ACF) Flip-chip Interconnect in Over GHz RF Clock Distribution System / Ryu, W., Yim, M., Paik, K., Kim, J. 153

Processing & Interconnection technologies II

Development of a Rework-Technology for Flip-Chips, Using No-Flow Underfills / Wolter, K., Fruhauf, P. 159

Applicability of no-flow fluxing encapsulants and Flip Chip technology in volume production / Puhakka, K., Heimonen, T., Palm, P., Maattanen, J., Tuominen, A. 163

Epoxy Adhesives with Soldering Properties / Lantzsch, M. 168

Materials Development: Design & Modeling II

Development of Processing Diagrams for Underfill Resins / Taweeplengsangsuke, J., Pearson, R. A. 174

Applying Polymer Process Studies Using Molecular Modeling / Iwamoto, N.E. 182

Cluster effects on electrical conductance of isotropically conductive adhesive / Fu, Y., Willander, M., Liu, J 188

Modelling of ICA Creep Properties / Rusanen, O. 194

Reliability II

The Evaluation of Anisotropically Conductive Film for use in Portable Electronic Products / Curran, K., Holloway, M., Lennox, A. 199

Reliability Study of Sub 100 Micron Pitch, Flex-to-ITO/glass Interconnection, Bonded with an Anisotropic Conductive Film / Hogerton, P., Murray, C., Chheang, T., Rudman, R., Egeberg, H. 200

Industrial approach of a Flip-Chip method using the stud-bumps with a non-conductive paste / Ferrando, F., Zeberli, J., Clot, P., Chenuz, J. 205

ICA Performance

Electric Field Effects in the Production of ICA Joints / Heuschkel, M., Morris, J. 212

Conductive Adhesive for Plated Sn or Sn/Pb Electrode / Komagata, M., Toida, G., Hocchi, T., Suzuki, K. 216

Effect of Cure Temperature on Impact Resistance of Conductive Adhesives / MacDavitt, S., Morris, J. 221

Materials Characterization & Interconnections Performance

Characterization of Thin Layers in Microelectronic Packaging using Acoustic Microscopy / Canumalla, S., Kessler, L., Bhattacharya, S. 225

Characterization and Performance of Electrically Conductive Adhesives For Microwave Applications. / Felba, J., Friedel, K., Moscicki, A. 232

Materials Development: Design & Modeling III

The Influence of Adhesive Composition on Mechanical and Electrical Properties of Joints between SMDs and PCBs / Kisiel, R. 240

Adhesion Comparison between Thermosetting and Thermoplastic Resin Systems Based on Poly (Bisphenol A-co-Epichlorohydrin) Chemistry / Fan, L., Wong, C.P. 243

Adhesion & Interfacial Properties III

Adhesion between Photosensitive Epoxy and Electroless Copper / Ge, J., Tuominen, R., Kivilahti, J. 248

Mechanics of Polymer/Metal Interfaces in Microelectronic Packaging / Qu, J. 253

Correlation of Single Lap Joint Strength, and Deformation with Joint Resistance, Surface, and Cure Conditions / Sancaktar, E., Gomatam R. 254

High Density Substrates I

Advanced Substrates for Wireless Terminals / Savolainen, P. 264

A Novel IMB Technology for Integrating Active and Passive Components / Tuominen, R., Kivilahti, J. 269

Processing and Performance of High Density Interconnect (HDI) PWB with Laser Microvias / Rapala-Virtanen, T. 274

High Density Substrates II

A build-up substrate utilizing a new via fill technology by electroplating / Wakabayashi, S., Koyama, S., Iijiama, T., Nakazawa, M., Kaneko, N. 280

Laser Processing of Adhesives and Polymeric Materials for Microelectronics Packaging Application / Illyefalvi-Vitez, Z. 289

Advanced Environmental Friendly Materials for HDI Applications / Hanamura, K., Honda, N, Suzuki, T., Aoki, M. 296

Special Session: Roadmaps on Adhesives in the framework of EU Consortium Thematic Netowrk - Adhesives in Electronics

Thematic Network "Adhesives in Electronics", A Two Year Review and Future Plans / Kergel, H. 304

Roadmap "Adhesives Technologies in Automotive and Harsh Environment Applications" / Rusanen, O., Rohde, H., Brielmann, V. 307

Roadmap "Adhesives Technologies for Mobile and Consumer Applications" / Noerlyng, S.

Thematic Network "Adhesives in Electronics" Smart Card Roadmap / Aschenbrenner, R., Miessner, R. 310.

Notes:

Sponsored by, NOKIA ...

Includes bibliographical references and index.

ISBN:

0780364600

9780780364608

OCLC:

45134977

Access Restriction:

Restricted for use by site license.