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ITherm 2000. the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, presented at Las Vegas, Nevada, USA, May 23-26, 2000 / sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by Gary B. Kromann, J. Richard Culham, Koneru Ramakrishna.
- Format:
- Book
- Conference/Event
- Conference Name:
- InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (7th : 2000 : Las Vegas, Nev.)
- Language:
- English
- Subjects (All):
- Electronic apparatus and appliances--Thermal properties--Congresses.
- Electronic apparatus and appliances.
- Heat sinks (Electronics)--Congresses.
- Heat sinks (Electronics).
- Ball grid array technology--Congresses.
- Ball grid array technology.
- Electronic apparatus and appliances--Thermal properties.
- Genre:
- Conference papers and proceedings.
- Physical Description:
- 2 volumes : illustrations
- Other Title:
- Thermal and thermomechanical phenomena in electronic systems
- Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
- Place of Publication:
- Piscataway, N.J. : IEEE, 2000.
- System Details:
- Mode of access: World Wide Web.
- text file
- Notes:
- "IEEE Catalog Number: 00CH37069"--P. ii.
- Includes bibliographical references and index.
- ISBN:
- 0780359127
- 9780780359123
- 0780359135
- 9780780359130
- 0780359143
- 9780780359147
- OCLC:
- 44760997
- Access Restriction:
- Restricted for use by site license.
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