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Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging, April 15-17, 1998, The Adam's Mark Hotel, Denver, Colorado / sponsored by IMAPS ... [and others].
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- Book
- Conference/Event
- Conference Name:
- International Conference on Multichip Modules and High Density Packaging (1998 : Denver, Colo.)
- Language:
- English
- Subjects (All):
- Multichip modules (Microelectronics)--Congresses.
- Multichip modules (Microelectronics).
- Microelectronic packaging--Congresses.
- Microelectronic packaging.
- Genre:
- Conference papers and proceedings.
- Physical Description:
- xi, 547 pages : illustrations
- Other Title:
- Multichip modules and high density packaging
- Multichip Modules and High Density Packaging, 1998, proceedings, 1998 7th International Conference on.
- Place of Publication:
- [New York] : Institute of Electrical and Electronics Engineers, [1998]
- System Details:
- Mode of access: World Wide Web.
- text file
- Summary:
- Now in its seventh year, MCM has expanded to reflect the evolution and applications since 1992. The MCMs most commonly envisioned in 1992 interconnected 60 to 100 chips on a thin film substrate.
- Notes:
- "IEEE catalog number: 98EX154"--T.p. verso.
- Includes bibliographical references and index.
- ISBN:
- 0780348508
- 9780780348509
- 0780348516
- 9780780348516
- OCLC:
- 39914256
- Access Restriction:
- Restricted for use by site license.
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