Twenty first IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 13-15, 1997, Austin, TX, USA / general chair, Don Millard.

Format:

Book

Conference/Event

Contributor:

Millard, Don.

IEEE Xplore (Online service)

Semiconductor Equipment and Materials International.

Components, Packaging & Manufacturing Technology Society.

Conference Name:

IEEE/CPMT International Electronics Manufacturing Technology Symposium (21st : 1997 : Austin, Tex.)

Language:

English

Subjects (All):

Electronic industries--Congresses.

Electronic industries.

Electronic apparatus and appliances--Design and construction--Congresses.

Electronic apparatus and appliances.

Electronic apparatus and appliances--Design and construction.

Production engineering--Congresses.

Production engineering.

Electronic packaging--Congresses.

Electronic packaging.

Genre:

Conference papers and proceedings.

Physical Description:

xiv, 482 pages : illustrations

Other Title:

Electronics Manufacturing Technology Symposium, 1997, Twenty-First IEEE/CPMT International.

Place of Publication:

[New York] : Institute of Electrical and Electronics Engineers ; Piscataway, NJ : May be purchased from IEEE Service Center, [1997]

System Details:

Mode of access: World Wide Web.

text file

Contents:

Reliability

Assembly processes I

Semiconductor processing

Environmentally conscious manufacturing

Test, inspection and characterization

Packaging

Assembly processes II

Contract manufacturing

Flip chip

Sub 0.25 nm lithography

Ball grid array

Scheduling in semiconductor manufacturing.

Notes:

"Sponsored by Semiconductor Equipment & Materials Int'l., the Components, Packaging & Manufacturing Technology Society of the IEEE"--Cover.

"IEEE catalog number: 97CH36068"--T.p. verso.

Includes bibliographical references and index.

ISBN:

0780339290

9780780339293

0780339304

9780780339309

0780339312

9780780339316

OCLC:

39042577

Access Restriction:

Restricted for use by site license.