Proceedings. 3rd International Symposium on Advanced Packaging Materials--processes, properties, and interfaces, Chateau Elan, Braselton, Georgia, March 9-12, 1997 / co-sponsored by International Microelectronics and Packaging Society (IMAPS), IEEE Components, Packaging, and Manufacturing Technology Society, Georgia Institute of Technology, Packaging Research Center (PRC) ; participating societies: American Society of Materials ... [and others].

Format:

• Book
• Conference/Event

Contributor:

• IEEE Xplore (Online service)
• International Microelectronics and Packaging Society.
• Components, Packaging & Manufacturing Technology Society.
• Georgia Institute of Technology. Packaging Research Center.
• ASM International.

Conference Name:

• International Symposium on Advanced Packaging Materials (3rd : 1997 : Braselton, Ga.)

Language:

English

Subjects (All):

• Electronic packaging--Materials--Congresses.
• Electronic packaging--Materials.

Genre:

• Conference papers and proceedings.

Physical Description:

viii, 183 pages : illustrations

Other Title:

Advanced Packaging Materials, proceedings, 3rd International Symposium on.

Place of Publication:

[New York] : Institute of Electrical and Electronics Engineers, 1997.

System Details:

• Mode of access: World Wide Web.
• text file

Notes:

Includes bibliographical references and index.

ISBN:

• 0780338189
• 9780780338180

OCLC:

38144496

Access Restriction:

Restricted for use by site license.