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Proceedings, 1997 IEEE Multi-Chip Module Conference. February 4-5, 1997, Santa Cruz, California / sponsored by IEEE Computer Society ... [and others].
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View online- Format:
- Book
- Conference/Event
- Conference Name:
- IEEE Multi-Chip Module Conference (1997 : Santa Cruz, Calif.)
- Language:
- English
- Subjects (All):
- Multichip modules (Microelectronics)--Congresses.
- Multichip modules (Microelectronics).
- Thin films--Congresses.
- Thin films.
- Neural networks (Computer science)--Congresses.
- Neural networks (Computer science).
- CAD/CAM systems--Congresses.
- CAD/CAM systems.
- Optoelectronic devices--Congresses.
- Optoelectronic devices.
- Genre:
- Conference papers and proceedings.
- Physical Description:
- x, 171 pages : illustrations
- Other Title:
- 1997 IEEE Multi-Chip Module Conference
- IEEE Multi-Chip Module Conference
- Also known as: MCMC '97
- Multi-Chip Module Conference, 1997, MCMC '97, 1997 IEEE.
- Place of Publication:
- Los Alamitos, Calif. : IEEE Computer Society Press, [1997]
- System Details:
- Mode of access: World Wide Web.
- text file
- Contents:
- Session 1. Flip-chip I
- Session II. Mixed signal MCMs
- Session III. MCM design and CAD
- Session IV: Panel: The best road to integration? Single chip or multi-chip?
- Session V: Interconnect analysis and simulation
- Session VI. Flip-chip II
- Session VII. Test, technology and infrastructure
- Session VIII: Optical MCMs
- Session IX: Wrap up panel
- Author index.
- Notes:
- "IEEE catalog number 97CB36039"--T.p. verso.
- Includes bibliographical references and author index.
- ISBN:
- 0818677899
- 9780818677892
- 0780339037
- 9780780339033
- OCLC:
- 36524697
- Access Restriction:
- Restricted for use by site license.
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