I-THERM V. May 29-June 1, 1996, Buena Vista Palace Hotel, Orlando, FL, U.S.A. / co-sponsored by ... the K-16 Committee on Heat Transfer in Electronic Equipment, Heat Transfer Division, American Society of Mechanical Engineers (ASME) .. [and others].

Format:

Book

Conference/Event

Contributor:

IEEE Xplore (Online service)

American Society of Mechanical Engineers. K-16 Committee on Heat Transfer in Electronic Equipment.

Conference Name:

InterSociety Conference on Thermal Phenomena in Electronic Systems (5th : 1996 : Orlando, Fla.)

Language:

English

Subjects (All):

Electronic apparatus and appliances--Thermal properties--Congresses.

Electronic apparatus and appliances.

Heat sinks (Electronics)--Congresses.

Heat sinks (Electronics).

Ball grid array technology--Congresses.

Ball grid array technology.

Electronic apparatus and appliances--Thermal properties.

Genre:

Conference papers and proceedings.

Physical Description:

xxi, 407 pages : illustrations

Other Title:

I-THERM 5

I-THERM five

1996 Intersociety Conference on Thermal Phenomena in Electronic Systems

Added title on t.p.: 1996 proceedings 5th Intersociety Conference on Thermal Phenomena in Electronic Systems

Thermal Phenomena in Electronic Systems, 1996, I-THERM V, Inter-Society Conference on.

Place of Publication:

[New York] : Institute of Electrical and Electronics Engineers ; Piscataway, NJ : IEEE Service Center [distributor], [1996]

System Details:

Mode of access: World Wide Web.

text file

Notes:

"This symposium is a trans-disciplinary forum for exploring the progress made in understanding, analyzing, and modeling thermal transport processes and thermally-induced failures in the fabrication, assembly, and use of semiconductors, data-storage devices, and electronic systems."

"IEEE catalog number: 96CH35940"--T.p. verso.

Includes bibliographical references.

ISBN:

078033325X

9780780333253

0780333268

9780780333260

OCLC:

35314999

Access Restriction:

Restricted for use by site license.