I-THERM IV. May 4-7, 1994, Washington Hilton, Washington, DC, USA : InterSociety Conference on Thermal Phenomena in Electronic Systems / co-sponsored by ... the K-16 Committee on Heat Transfer in Electronic Equipment, Heat Transfer Division, American Society of Mechanical Engineers (ASME) .. [and others].

Format:

Book

Conference/Event

Contributor:

IEEE Xplore (Online service)

American Society of Mechanical Engineers. K-16 Committee on Heat Transfer in Electronic Equipment.

Components, Packaging & Manufacturing Technology Society.

Conference Name:

InterSociety Conference on Thermal Phenomena in Electronic Systems (4th : 1994 : Washington, D.C.)

Language:

English

Subjects (All):

Electronic apparatus and appliances--Thermal properties--Congresses.

Electronic apparatus and appliances.

Concurrent engineering--Congresses.

Concurrent engineering.

Electronic apparatus and appliances--Thermal properties.

Genre:

Conference papers and proceedings.

Physical Description:

xi, 292 pages : illustrations

Other Title:

I-THERM 4

I-THERM four

InterSociety Conference on Thermal Phenomena in Electronic Systems

Thermal phenomena in electronic systems

Added title on t.p.: Concurrent engineering and thermal phenomena

Thermal Phenomena in Electronic Systems, 1994, I-THERM IV, "Concurrent Engineering and Thermal Phenomena", InterSociety Conference on.

Place of Publication:

[New York] : Institute of Electrical and Electronics Engineers, [1994]

System Details:

Mode of access: World Wide Web.

text file

Notes:

Theme: Concurrent engineering and thermal phenomena.

"IEEE catalog number: 94CH3340-7"--T.p. verso.

"Principal sponsor, the IEEE-CPMT Society"--P. iii.

Includes bibliographical references.

ISBN:

0780313739

9780780313736

OCLC:

30637658

Access Restriction:

Restricted for use by site license.