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1994 proceedings. Sixth Annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA / sponsored by IEEE Computer Society, IEEE Components, Packaging & Manufacturing Technology Society ; edited by R. Mike Lea and Stuart Tewksbury.
- Format:
- Book
- Conference/Event
- Conference Name:
- International Conference on Wafer Scale Integration (6th : 1994 : San Francisco, Calif.)
- Language:
- English
- Subjects (All):
- Integrated circuits--Wafer-scale integration--Congresses.
- Integrated circuits.
- Integrated circuits--Wafer-scale integration.
- Genre:
- Conference papers and proceedings.
- Physical Description:
- ix, 404 pages : illustrations
- Other Title:
- 1994 IEEE International Conference on Wafer Scale Integration
- Sixth Annual IEEE International Conference on Wafer Scale Integration
- Wafer scale integration
- Wafer Scale Integration, 1994, Proceedings, Sixth Annual IEEE International Conference on.
- Place of Publication:
- [New York, N.Y.] : Institute of Electrical and Electronics Engineers ; Piscataway, NJ : Additional copies from IEEE Service Center, [1994]
- System Details:
- Mode of access: World Wide Web.
- text file
- Notes:
- "IEEE Catalog Number 94CH3412-4"--T.p. verso.
- Includes bibliographical references and index.
- ISBN:
- 0780318501
- 9780780318502
- 0780318498
- 9780780318496
- 078031851X
- 9780780318519
- OCLC:
- 30449210
- Access Restriction:
- Restricted for use by site license.
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