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Multichip modules. international conference and exhibition, 14-16 April 1993, Denver, Colorado / sponsored by ISHM--the Microelectronics Society, the International Electronics Packaging Society ; in cooperation with IEEE/Components, Hybrids, and Materials Technology Section, IPC--the Institute for Interconnecting and Packaging Electronic Circuits ; endorsed by EIA--Electronic Industrial Association.
- Format:
- Book
- Conference/Event
- Conference Name:
- International Conference and Exhibition on Multichip Modules (2nd : 1993 : Denver, Colo.)
- Series:
- Proceedings of SPIE--the International Society for Optical Engineering ; v.
- Proceedings ; v. 1986
- Language:
- English
- Subjects (All):
- Multichip modules (Microelectronics)--Congresses.
- Multichip modules (Microelectronics).
- Electronic packaging--Congresses.
- Electronic packaging.
- Microelectronic packaging--Congresses.
- Microelectronic packaging.
- Genre:
- Conference papers and proceedings.
- Physical Description:
- x, 604 pages : illustrations.
- Place of Publication:
- Bellingham, Wash. : Published by ISHM and IEPS in cooperation with SPIE--the International Society for Optical Engineering, [1993]
- System Details:
- Mode of access: World Wide Web.
- text file
- Notes:
- Papers from the Second International Conference and Exhibition on Multichip Modules.
- Includes bibliographical references.
- ISBN:
- 0930815378
- 9780930815370
- OCLC:
- 30032036
- Access Restriction:
- Restricted for use by site license.
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