Nanofabrication : principles, capabilities and limits / Zheng Cui.

Format:

Book

Author/Creator:

Cui, Zheng, 1954-

Language:

English

Subjects (All):

Nanotechnology.

Physical Description:

xii, 343 pages : illustrations ; 25 cm

Place of Publication:

Berlin : Springer, 2008.

Summary:

Nanofabrication: Principles, Capabilities and Limits presents a one-stop description at the introductory level on most technologies that have been developed which are capable of making structures below 100nm.

Principles of each technology are introduced and illustrated with minimum mathematics involved. The capabilities of each technology in making sub-100nm structures are described. The limits of preventing a technology from further going down the dimensional scale are analyzed.

Drawing upon years of practical experience and using numerous examples, Zheng Cui covers state-of-the-art technologies in nanofabrication including: Photon-based lithography, Charged particle beams lithography, Nanofabrication using scanning probes, Nanoscale replication, Nanoscale pattern transfer, Indirect nanofabrication, Nanofabrication by self-assembly.

Nanofabrication: Principles, Capabilities and Limits will serve as a practical guide and first-hand reference for researchers and practitioners working in nanostructure fabrication and also provides a "tool box" of various techniques that can be easily adapted in different fields of applications.

Contents:

1.1 Nanotechnology 1

1.2 Nanofabrication 2

2 Nanofabrication by Photons 7

2.2 Principle of Optical Projection Lithography 8

2.3 Optical Lithography at Shorter Wavelengths 13

2.3.1 Deep UV 13

2.3.2 Extreme UV 16

2.3.3 X-ray 20

2.4 Optical Lithography at High NA 22

2.5 Optical Lithography at Low k[subscript 1] Factor 30

2.5.1 Off-Axis Illumination (OAI) 33

2.5.2 Phase-Shifting Mask (PSM) 34

2.5.3 Optical Proximity Correction (OPC) 38

2.5.4 Photoresists 44

2.5.5 Design for Manufacturing (DFM) 53

2.5.6 Double Processing 54

2.6 Near-Field Optical Lithography 57

2.7 Interferometric Optical Lithography 63

2.8 Maskless Optical Lithography 67

3 Nanofabrication by Charged Beams 77

3.2 Focusing Charged Particle Beam 79

3.2.1 Charged Particle Optics 79

3.2.3 Aberrations 85

3.3 Scattering and Proximity Effect 89

3.3.1 Electron Scattering 89

3.3.2 Proximity Effect and Correction 94

3.3.3 Effect of Secondary Electrons 99

3.3.4 Low-Energy E-Beam Lithography 101

3.3.5 Ion Scattering 105

3.4 Resist Materials and Processes 106

3.4.1 Sensitivity of Resist Materials 107

3.4.2 Contrast of Resist Materials 112

3.4.3 Resolution Enhancement Processes 114

3.5 Ion Sputtering and Redeposition 117

3.6 Charged Particles Projection Lithography 120

4 Nanofabrication by Scanning Probes 129

4.2 Principles of SPMs 130

4.3 Exposure of Resists 133

4.3.1 Field Electron Emission 133

4.3.2 Exposure of Resist by STM 135

4.3.3 Exposure of Resist by NSOM 139

4.4 Local Oxidation Lithography 140

4.5 Additive Nanofabrication 143

4.5.1 Field-Induced Deposition 143

4.5.2 Dip-Pen Nanolithography 145

4.6 Subtractive Nanofabrication 147

4.6.1 Electrochemical Etching 147

4.6.2 Field-induced Decomposition 148

4.6.3 Thermomechanical Indentation 149

4.6.4 Mechanical Scratching 150

4.7 High-Throughput SPL 153

5 Nanofabrication by Replication 161

5.2 Thermal Press Nanoimprint 162

5.2.1 Nanoimprint Stamps 164

5.2.2 Nanoimprint Polymers 166

5.2.3 Demolding 169

5.2.4 Alignment 172

5.3 Room Temperature Nanoimprint 173

5.4 UV-Cured Nanoimprint 176

5.4.1 Transparent Stamps 176

5.4.2 UV Curable Polymers 180

5.4.3 Step-and-Flash Imprint Lithography 183

5.4.4 Alignment Through Transparent Stamps 187

5.4.5 Combined Nanoimprint and Photolithography 189

5.5 Reverse Nanoimprint 192

5.6 Soft Lithography 196

5.6.1 Soft Stamps 197

5.6.2 Microcontact Printing 199

5.6.3 Replication by Capillary Force 202

6 Nanoscale Pattern Transfer 211

6.2 Additive Pattern Transfer 212

6.2.1 Thin Film Deposition 212

6.2.2 Pattern Transfer by Lift-Off 218

6.2.3 Pattern Transfer by Plating 226

6.2.4 Damascene Process 229

6.2.5 Pattern Transfer by Stencil Mask 231

6.3 Subtractive Pattern Transfer 234

6.3.1 Isotropic Wet Etching 234

6.3.2 Anisotropic Wet Etching 236

6.3.3 Reactive-Ion Etching (RIE) 238

6.3.4 Process Control in Nanoscale RIE 242

6.3.5 RIE by Inductively Coupled Plasma 249

6.3.6 Critical Issues in RIE 253

6.3.7 Ion Milling 258

7 Indirect Nanofabrication 267

7.2 Sidewall Lithography 268

7.3 Dimensional Subtraction and Addition 272

7.3.1 Lateral Subtraction 272

7.3.2 Lateral Addition 278

7.3.3 Vertical Subtraction 280

7.3.4 Nanosphere Lithography 283

7.4 Multistep Processing 285

7.5 Super Resolution Patterning 287

8 Nanofabrication by Self-Assembly 295

8.2 Self-Assembly Processes 296

8.3 Guided Self-Assembly 304

8.3.1 Surface Topography 305

8.3.2 Surface Wetting 305

8.3.3 Electrostatic Force 308

8.3.4 Magnetic Force 310

8.4 Building Blocks of Future Nanosystems 312

8.4.1 DNA Scaffold 313

8.4.2 Carbon Nanotubes 316

8.4.3 Block Copolymers 321

8.4.4 Porous Alumina 324.

Notes:

Includes bibliographical references and index.

ISBN:

0387755764

9780387755762

OCLC:

191760094