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Microsystem engineering of lab-on-a-chip devices / edited by Oliver Geschke, Henning Klank, Pieter Tellemann.
LIBRA TK7874 .M52 2008
Available from offsite location
- Format:
- Book
- Language:
- English
- Subjects (All):
- Microelectronics.
- Physical Description:
- xi, 285 pages : illustrations ; 25 cm
- Edition:
- Second, revised and enlarged edition.
- Place of Publication:
- Weinheim : Wiley-VCH ; Chichester : John Wiley [distributor], 2008.
- Summary:
- Edited by an interdisciplinary team of scientists at one of the leading centers for microsystem research, this second edition retains the proven structure of its predecessor, enlarged by around 10%. Focusing on analytical applications mainly in life sciences, this is an invaluable companion for fast and automated analytical procedures, providing a concise practical approach to microtechnology.
- Contents:
- 1.1 Learning from the Experiences of Microelectronics 1
- 1.2 The Advantages of Miniaturizing Systems for Chemical Analysis 2
- 1.3 From Concept to [mu]TAS 4
- 2 Clean Rooms / Daria Petersen, Pieter Telleman 9
- 3 Microfluidics - Theoretical Aspects / Jorg P. Kutter, Henning Klank 13
- 3.1 Fluids and Flows 14
- 3.2 Transport Processes 21
- 3.2.1 Types of Transport 21
- 3.2.1.1 Convection 21
- 3.2.1.2 Migration 22
- 3.2.1.3 Diffusion 23
- 3.2.1.4 Dispersion 26
- 3.3 System Design 26
- 3.3.1 Laminar Flow and Diffusion in Action 27
- 3.4 An Application: Biological Fluids 35
- 4 Microfluidics - Components / Jorg P. Kutter, Klaus Bo Mogensen, Henning Klank, Oliver Geschke 39
- 4.1 Valves and Pumps 39
- 4.1.1 Moving Liquids by Electroosmosis 46
- 4.1.2 Mixers 50
- 4.2 Injecting, Dosing, and Metering 54
- 4.3 Temperature Measurement in Microfluidic Systems 58
- 4.3.1 Microreactors 59
- 4.3.2 Temperature Sensors for Microsystems 60
- 4.3.3 Resistance Temperature Detectors 60
- 4.3.3.1 Metals 60
- 4.3.3.2 Nonmetals 61
- 4.3.4 Thermocouples 63
- 4.3.5 Semiconductor Junction Sensors 63
- 4.3.6 Temperature Sensors Built on Other Principles 64
- 4.4 Optical Sensors 65
- 4.4.1 Instrumentation 66
- 4.4.2 Absorption Detection 67
- 4.4.3 Optical Waveguidance 70
- 4.4.4 Fluorescence Detection 74
- 4.5 Electrochemical Sensors 77
- 5 Simulations in Microfluidics / Goran Goranovic, Henrik Bruus 83
- 5.1 Physical Aspects and Design 84
- 5.2 Choosing Software and Hardware 87
- 5.2.1 CFD-ACE+Version 6.6 87
- 5.2.2 CoventorWare Version 2001.3 88
- 5.2.3 Hardware 89
- 5.2.4 The Core Elements of Typical CFD Software 89
- 5.2.5 Pre-processors 89
- 5.2.6 Solvers 93
- 5.2.7 Post-processors 93
- 5.3 Important Numerical Settings 94
- 5.3.1 Boundary Conditions 94
- 5.3.2 Solver Settings 95
- 5.4 Errors and Uncertainties 99
- 5.5 Interpretation and Evaluation of Simulations 99
- 5.6 Example Simulations 100
- 5.6.1 Fully-developed Flow in a Circular Capillary 100
- 5.6.2 Movement of a Chemical Plug by Electroosmotic Flow in a Detection Cell 104
- 6 Silicon and Cleanroom Processing / Anders Michael Jorgensen, Klaus Bo Mogensen 121
- 6.1 Substrate Fabrication 122
- 6.2 Optical Lithography 126
- 6.2.1 Photolithography 126
- 6.2.2 Mask Design 131
- 6.2.3 Hints in Planning Fabrication Runs 134
- 6.3 Deposition 136
- 6.3.1 Fundamentals of Coatings 136
- 6.3.2 Deposition Methods 138
- 6.3.3 Materials 142
- 6.3.4 Lift-off 146
- 6.3.5 Silicides 147
- 6.4 Etching 147
- 6.4.1 Wet-etching Fundamentals 148
- 6.4.2 Etching with HF 148
- 6.4.3 Isotropic Silicon Etch 149
- 6.4.4 Orientation-dependent Silicon Etching 150
- 6.4.5 Common Orientation-dependent Etchants 152
- 6.4.6 Other Etchants 152
- 6.4.7 Effects of Not Stirring a Transport-limited Etch 152
- 6.5 Dry Etching 153
- 6.5.1 Plasma Etching Fundamentals 154
- 6.5.2 Plasma Etching Setups 156
- 6.5.3 Etch Gases 159
- 6.5.4 Laser-assisted Etching 160
- 6.6 Heat Treatment 160
- 6.6.1 Thermal Oxidation 160
- 6.6.2 Diffusion 163
- 6.6.3 Annealing 164
- 6.6.4 Wafer Bonding 164
- 7 Glass Micromachining / Daria Petersen, Klaus Bo Mogensen, Henning Klank 167
- 7.1 Wet Chemical Etching 169
- 7.2 Reactive Ion Etching (RIE) of Glass 169
- 7.3 Laser Patterning 169
- 7.4 Powder Blasting 170
- 7.5 Glass Bonding 170
- 7.6 A Microfabrication Example 172
- 8 Polymer Micromachining / Oliver Geschke, Henning Klank, Klaus Bo Mogensen 175
- 8.1 Hot Embossing 176
- 8.2 Injection Molding 179
- 8.3 Casting 179
- 8.3.1 A microfabrication example: Casting of polydimethylsiloxane (PDMS) microfluidic devices 180
- 8.4 Laser Micromachining 181
- 8.5 Milling 183
- 8.6 X-ray and Ultraviolet Polymer Lithography 184
- 8.7 Sealing of Polymer Microstructures 185
- 8.8 Adding Functionalities 187
- 8.9 Examples of Polymer Microstructures 188
- 9 Packaging of microfluidic Systems / Gerardo Perozziello 193
- 9.1 Levels of packaging 195
- 9.1.1 Substrate Level Packaging 195
- 9.1.2 Multichip Packages 196
- 9.1.3 Unconventional packages 197
- 9.2 Factors influencing the packaging design and reliability 198
- 9.3 Materials 199
- 9.4 Interconnections 201
- 9.4.1 Fluidic interconnections 201
- 9.4.2 Fluidic interconnections modeling 204
- 9.4.2.1 External interconnections modeling 204
- 9.4.2.2 Integrated interconnection modeling 205
- 9.4.3 Electrical Interconnections 208
- 9.4.4 Optical interconnections 210
- 9.4.4.1 Waveguides 212
- 9.4.4.2 Outer world optical connection 215
- 10 Determination of Topography / Henning Klank
- 10.1 Topography - General Discussion 221
- 10.2 Importance and Relevance of Topography 222
- 10.3 Topographical Determination Considerations 222
- 10.3.1 Sample Positioning 222
- 10.3.2 Invasive and Non-invasive Measurement Methods 223
- 10.3.3 Range and Resolution 223
- 10.3.4 Dimensions 224
- 10.3.5 Geometrical Considerations 224
- 10.4 Topographical Characterization Methods and Instruments 224
- 10.4.2 Profilometer 224
- 10.4.2.1 Operating Principle 224
- 10.4.2.2 Advantages and Disadvantages 225
- 10.4.3 Optical Microscope 226
- 10.4.3.1 Operating Principle 226
- 10.4.3.2 Advantages and Disadvantages 228
- 10.4.4 Scanning Electron Microscope (SEM) 229
- 10.4.4.1 Operating Principle 229
- 10.4.4.2 Advantages and Disadvantages 231
- 10.4.4.3 Environmental Scanning Electron Microscope (ESEM) 232
- 10.4.5 Atomic Force Microscope (AFM) 233
- 10.4.5.1 Operating Principle 233
- 10.4.5.2 Advantages and Disadvantages 234
- 10.4.6 Confocal Microscope 235
- 10.4.6.1 Operating Principle 235
- 10.4.6.2 Advantages and Disadvantages 236
- 10.5 Topographical Examination of a Typical Sample 238
- 11 Analytical Chemistry on Microsystems / Jorg Kutter, Oliver Geschke
- 11.1 Sensors and Sensor Systems 244
- 11.2 Biosensors 247
- 11.3 Flow Injection Analysis 249
- 11.4 Separation Techniques 252
- 11.4.1 Free-zone Electrophoresis 254
- 11.4.2 Gel Electrophoresis 256
- 11.4.3 Micellar Electrokinetic Chromatography (MEKC) 257
- 11.4.4 Open-channel Electrochromatography (OCEC) 260
- 11.4.5 Packed-bed Chromatography 261
- 11.4.6 Microfabricated Stationary-phase Support Structures 261
- 11.4.7 In-situ-polymerized Stationary Phases 264
- 11.4.8 Synchronous Cyclic Capillary Electrophoresis (SCCE) 265
- 11.4.9 Two-dimensional Separations 266
- 11.4.10 Hydrodynamic Chromatography (HDC) 268
- 11.4.11 Shear-driven Chromatography 269
- 11.5 Other Analytical Techniques 270
- 11.5.1 Solid-phase Extraction (SPE) 270
- 11.5.2 Electrokinetic Enrichment of DNA 272
- 11.5.3 Electrostacking 272.
- Notes:
- Previous ed.: 2004.
- Includes bibliographical references and index.
- ISBN:
- 9783527319428
- 3527319425
- OCLC:
- 173721105
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