Electronic composites / Minoru Taya.

Format:

Book

Author/Creator:

Taya, Minoru.

Contributor:

Sabin W. Colton, Jr., Memorial Fund.

Language:

English

Subjects (All):

Electronics--Materials.

Electronics.

Composite materials--Electric properties.

Composite materials.

Physical Description:

xiii, 360 pages : illustrations ; 25 cm

Place of Publication:

Cambridge : Cambridge University Press, 2005.

Summary:

Electronic composites, whose properties can be controlled by thermal or electromagnetic means, play an important role in micro- and nano-electromechanical systems (MEMS/NEMS) such as sensors, actuators, filters, and switches. This book describes the processing, simulation, and applications of electronic composites, beginning with a review of their mechanical, thermal, electromagnetic, and coupling behavior; their major applications are then discussed. All the key simulation models are described in detail and illustrated by reference to real examples. The book closes with a discussion of electronic composite processing, including MEMS design and packaging. It contains a comprehensive list of references and is aimed at graduate students of electrical engineering and materials science. It will also be a useful reference for researchers and engineers in the MEMS industry.

Contents:

1.1 What is an electronic composite? 1

1.2 Early modeling of electronic composites 2

1.3 Concept of electric, magnetic, and thermal circuits 15

2 Applications of electronic composites 19

2.1 Electronic packaging 19

2.2 Micro-electromechanical systems (MEMS) and BioMEMS 23

2.3 Composites for sensors and actuators 39

2.4 Control of electromagnetic waves 51

3 Foundations of modeling 69

3.2 Mechanical behavior 73

3.3 Thermal behavior 82

3.4 Electromagnetic behavior 87

3.5 Coupling behavior 119

3.6 Electrostriction 123

3.7 Magnetostriction 124

3.8 Piezomagnetism 125

4 Models for electronic composites based on effective medium theory 126

4.1 Law-of-mixtures model 126

4.2 Effective property tensor of a composite 130

4.3 Eshelby model 136

4.4 Concentration factor tensors 154

5 Resistor network model for electrical and thermal conduction problems 163

5.1 Electrical conduction 163

5.2 Thermal conduction 165

5.3 Comparison of model predictions with experimental data 169

6 Percolation model 173

6.1 Percolation model based on base lattices 173

6.2 Electrical conductivity by effective medium theory 180

6.3 Electrical conduction by percolation model 182

6.4 Fiber percolation model 187

6.5 Percolation model applied to piezoresistive elastomer composites 192

6.6 Percolation in a particle composite 200

7 Lamination model 208

7.1 Classical lamination theory under hygro-thermomechanical loading 208

7.2 Lamination theory applied to piezoelectric laminates 214

7.3 Accurate model for cylindrical bending of piezoelectric laminate composites 217

7.4 Design of functionally graded microstructure of piezoactuators 220

7.5 Thermal stress in coating/substrate system 232

7.6 Electromagnetic waves in laminated composites 254

8 Engineering problems 271

8.1 Processing 271

8.2 Standard measurement methods of properties 284

8.3 Electromigration 313

Appendix A Eshelby tensors 325

A1 Eshelby tensor S[superscript ijkl] for elasticity 325

A2 Eshelby tensors S[superscript ij] for uncoupled physical behavior 330

A3 Eshelby tensors for ellipsoidal inclusions in piezoelectric matrix 331

A4 Eshelby tensors in matrix form 333

Appendix B Physical constants and properties of materials 338

B1 Physical constants 338

B2 Thermal properties of popular packaging materials 338

B3 Dielectric constants [epsilon superscript r] of popular materials 340

B4 Magnetic properties of soft and hard magnets 341.

Notes:

Includes bibliographical references and index.

Local Notes:

Acquired for the Penn Libraries with assistance from the Sabin W. Colton, Jr., Memorial Fund.

ISBN:

0521841747

OCLC:

57574595

Publisher Number:

9780521841740

9780521841740 (hbk.)