Heat transfer in electronic equipment : presented at the winter annual meeting of the American Society of Mechanical Engineers, Washington, D.C., November 15-20, 1981 / sponsored by the K-12 Committee on Aircraft and Astronautical Heat Transfer, the Heat Transfer Division, ASME ; edited by Matthew D. Kelleher, M. Michael Yovanovich.

Format:

Book

Contributor:

Kelleher, Matthew D.

Yovanovich, M. Michael (Milan Michael)

American Society of Mechanical Engineers.

American Society of Mechanical Engineers. K-12 Committee on Aircraft and Astronautical Heat Transfer.

Language:

English

Subjects (All):

Electronic apparatus and appliances--Cooling--Congresses.

Electronic apparatus and appliances.

Electronic apparatus and appliances--Cooling.

Heat--Transmission--Congresses.

Heat.

Heat--Transmission.

Genre:

Conference papers and proceedings.

Physical Description:

v, 64 pages : illustrations ; 28 cm

Place of Publication:

New York, N.Y. (345 E. 47th St., New York 10017) : ASME, [1981]

Contents:

Thermal considerations in the packaging of electrical and electronic components / A. Bar-Cohen and A. Kraus

Thermally optimum spacing of vertical, natural convection cooled, parallel plates / A. Bar-Cohen and W.M. Rohsenow

Experimental investigations on the temperature rise of printed circuit boards in open cabinets with natural ventilation / H. Birnbreier

Evaluation of surface heat transfer coefficients for electronic module packages / M.L. Buller and R.F. Kilburn

Cooling techniques and thermal analysis of circuit board mounted electronic equipment / C.J. Feldmanis

Microelectronic device thermal resistance / R.J. Hannemann

Predicting performance of forced air cooled heat sinks / F. Wenthen

Boiling heat transfer of silicon integrated-circuit chips mounted on a substrate / U.P. Hwang and K.P. Moran

Heat transfer performance of a heat pipe radiator for a 1,000 ampere thyristor with air cooling / M.D. Xin ... [et al.]

Notes:

"HTD-vol. 20."

Includes bibliographical references.

OCLC:

8138735