Stress-induced phenomena in metallization : Sixth International Workshop on Stress-Induced Phenomena in Metallization, Ithaca, New York, 25-27 July 2001 / editors, Shefford P. Baker ... [and others].

Format:

Book

Conference/Event

Contributor:

Baker, Shefford P.

Conference Name:

International Workshop on Stress-Induced Phenomena in Metallization (6th : 2001 : Ithaca, N.Y.)

Series:

AIP conference proceedings ; no. 612.

AIP conference proceedings, 0094-243X ; v. 612

Language:

English

Subjects (All):

Semiconductors--Defects--Congresses.

Semiconductors.

Semiconductors--Defects.

Metallic films--Congresses.

Metallic films.

Thin film devices--Defects--Congresses.

Thin film devices.

Aluminum films--Congresses.

Aluminum films.

Metallizing--Congresses.

Metallizing.

Thin film devices--Defects.

Genre:

Conference papers and proceedings.

Physical Description:

ix, 250 pages : illustrations ; 25 cm.

Place of Publication:

Melville, N.Y. : American Institute of Physics, 2002.

Contents:

Part 1 Electromigration Stresses and Mechanisms

Electromigration in the Nineties / J. R. Lloyd 3

Electromigration in Epitaxial Cu(001) Lines / G. Ramanath, H. Kim, H. S. Goindi, M. J. Frederick, C.-S. Shin, R. Goswami, I. Petrov, J. E. Greene 10

Immortality of Cu Damascene Interconnects / S. P. Hau-Riege 21

The Electromigration Short-Length Effect in AlCu and Cu Interconnects / R. G. Filippi, P.-C. Wang, R. A. Wachnik, D. Chidambarrao, M. A. Korhonen, T. M. Shaw, R. Rosenberg, T. D. Sullivan 33

A High Reliability Copper Dual-Damascene Interconnection with Direct-Contact Via Structure / K. Ueno, M. Suzuki, A. Matsumoto, K. Motoyama, N. Oda, H. Miyamoto, S. Saito 49

Statistical Study of Electromigration Early Failures in Dual-damascene Cu/oxide Interconnects / K.-D. Lee, E. T. Ogawa, H. Matsuhashi, P. S. Ho 61

A Governing Parameter for Electromigration Damage in Passivated Polycrystalline Lines and its Verification / K. Sasagawa, M. Hasegawa, M. Saka, H. Abe 74

Influence of Grain Boundary Type on Electromigration in Damascene Copper Lines / H. Wendrock, S. Menzel, T. G. Koetter, D. Rauser, K. Wetzig 86

Evaluation of Temperature Rise Due to Joule Heating and Preliminary Investigation of its Effect on Electromigration Reliability / S. Shingubara, S. Miyazaki, H. Sakaue, T. Takahagi 94

First-Principle Theoretical Study on the Dynamical Electronic Characteristics of Electromigration in the Bulk, Surface and Grain Boundary / A. Tachibana 105

Part 2 Cyclic Loading Effects

Interconnect Failure due to Cyclic Loading / R. R. Keller, R. Monig, C. A. Volkert, E. Arzt, R. Schwaiger, O. Kraft 119

Damaging of Metallization Layers by High Power Surface Acoustic Wave Fields / S. Menzel, H. Schmidt, M. Weihnacht, K. Wetzig 133

Part 3 Stress Voiding

Cohesive Zone Models of Void Nucleation at Interconnect Interfaces / A. F. Bower 145

Stress-Induced Voiding in Aluminum and Copper Interconnects / M. Hommel, A. H. Fischer, A. v. Glasow, A. E. Zitzelsberger 157

A Relationship between Film Texture and Stress-Voiding Tendency in Copper Thin Films / J. Koike, A. Sekiguchi, M. Wada, K. Maruyama 169

Stress Voiding in Wide Copper Lines / T. M. Shaw, L. Gignac, X-H. Liu, R. R. Rosenberg 177

Evaluation of Interface Strength between Thin Films in an LSI Based on Fracture Mechanics Concept / T. Shibutani, Q. Yu, M. Shiratori, T. Kitamura 184

Part 4 Deformation and Stresses

Microdiffraction and Microfluorescence Studies of Electromigration-Induced Stresses and Composition Changes / G. S. Cargill III 193

Dominant Inelastic Mechanisms in FCC Metallic Thin Films and Lines / M. J. Kobrinsky, C. V. Thompson 205

High Resolution Microdiffraction Studies Using Synchrotron Radiation / R. Spolenak, N. Tamura, B. C. Valek, A. A. MacDowell, R. S. Celestre, H. A. Padmore, W. L. Brown, T. Marieb, B. W. Batterman, J. R. Patel 217

Grain Structure Evolution During Annealing of Electroplated Copper / S. H. Brongersma, E. Kerr, I. Vervoort, K. Maex 229

Stress Induced Metallurgical Effects in Ti/TiN/AlCu/TiN Metal Stacks / K. Koller, M. Hommel, S. Hummelt, H. Koerner 235.

Notes:

Includes bibliographical references and indexes.

ISBN:

073540058X

OCLC:

49723827