RF measurements of die and packages / Scott A. Wartenberg.

Format:

Book

Author/Creator:

Wartenberg, Scott A.

Series:

Artech House microwave library

Language:

English

Subjects (All):

Very high speed integrated circuits--Measurements.

Very high speed integrated circuits.

Integrated circuits--Masks--Design and construction.

Integrated circuits.

Microelectronic packaging.

Radio measurements.

Integrated circuits--Masks.

Physical Description:

xv, 224 pages : illustrations ; 24 cm.

Place of Publication:

Boston : Artech House, [2002]

Summary:

The explosion in the wireless industry, coupled with the higher frequencies in today's digital integrated circuits (IC) has made vital the need for accurate IC testing. This is the first book dedicated to the issues surrounding RFIC testing. This ground breaking work enables professionals to perform high-accuracy RF measurements of die and packages in the RF test lab. This timely volume defines the essential elements in an RF system, explains where errors can be found in such a system and shows how to mathematically remove them with calibration.

Contents:

1.1.1 Calibration 1

1.1.2 Coplanar Probes 2

1.1.3 High-Volume Probing 2

1.1.4 Test Fixtures 2

1.1.5 On-Wafer Characterization 4

1.1.6 RF Test Systems 4

1.1.7 Package Characterization 4

1.2 Components of an RF Test System 4

1.2.1 VNA 5

1.2.2 LCR Meter 7

1.2.3 RF Cables 8

1.2.4 Bias Cables 9

1.2.5 Bias Tees 10

1.3 RF Connectors 11

1.3.1 Connector Types 11

1.3.2 Making the Connection 11

1.3.3 Connector Care 12

1.4 RF Connector Adapters 12

1.5 The Probe Station 12

2 Calibration 15

2.1 Test System Errors: Random or Systematic 15

2.2 Concept of a Reference Plane 16

2.3 Error Models 17

2.3.1 Signal Flow Graph 19

2.3.2 Error Adapter 21

2.4 Calibration Standards 23

2.4.1 Calibration Coefficients 24

2.4.2 Short 25

2.4.3 Open 26

2.4.4 Load 28

2.4.5 Thru 29

2.5 Improving the Standards 31

2.5.1 Offset Delay 31

2.5.2 Offset Loss 33

2.6 Calibration Methods 33

2.6.1 SOLT 35

2.6.2 SOLR 37

2.6.3 TRL 38

2.6.4 LRM 41

2.6.5 LRRM 42

2.7 Verification 43

2.7.1 Verification Elements 44

2.7.2 Verifying with a Reference or "Golden" Unit 45

2.8 Isolation 45

2.9 Traceability 47

2.10 Repeatability, Reproducibility, and Accuracy 48

2.11 Calibration Tips and Tricks 48

3 Coplanar Probes 55

3.1 Theory of CPW 55

3.2 Mechanical Construction 57

3.3 Equivalent Circuit 58

3.4 Characterizing a Coplanar Probe 60

3.5 Using Coplanar Probes 62

3.5.1 Planarization 62

3.5.2 Alignment 63

3.5.3 Skating 64

3.5.4 Cleaning 67

3.6 Probe Configurations 67

3.6.1 Balanced 67

3.6.2 Unbalanced 68

3.6.3 Differential 69

3.6.4 Other Probe Configurations 71

3.7 Noncontact Probing 71

3.8 Applications 72

3.8.1 Millimeter-Wave Probing 72

3.8.2 Impedance-Matching, Low-Impedance Probes 73

3.9 Coplanar Probe Calibration Standards 74

3.9.1 Alumina Calibration Substrate 75

3.9.2 On-Wafer Calibration Standards 76

3.9.3 Open: In the Air or on Open Pads 77

3.9.4 More Design Tips 78

3.9.5 Verification 79

4 High-Volume Probing 83

4.1 High-Volume Test 84

4.2 RF Probe Card 84

4.2.1 Load Board 85

4.2.2 Probe Board 86

4.2.3 Contactor 86

4.3 Membrane Probe 88

4.3.1 Construction 88

4.4 Designing Membrane Probes 89

4.4.1 Digital and RF Signals 90

4.4.2 Grounding 90

4.5 Using Membrane Probes 91

4.6 Calibration 93

5 Test Fixtures 95

5.1 The Basic Test Fixture 95

5.1.1 Qualities of a Good Test Fixture 97

5.1.2 Characterizing the Fixture's Parasitic Effects 97

5.1.3 Types of Fixtures: R&D or Manufacturing 98

5.1.4 Fixturing for Passive Components 98

5.1.5 Fixturing for Active Components 99

5.2 RF Transitions 99

5.2.1 Coaxial to Microstrip 100

5.2.2 CPW to Microstrip 102

5.2.3 Rectangular Waveguide to CPW 102

5.2.4 Rectangular Waveguide to Microstrip 104

5.2.5 Rectangular Waveguide to Coaxial 105

5.3 Defining the Reference Planes 105

5.4 Two-Tier Calibration 107

5.5 Test Fixture Calibration 108

5.5.1 Calibration Standards: Coaxial Versus In-Fixture 108

5.5.2 Calibration Methods 109

5.5.3 Calibration Phase Uncertainty 111

6 On-Wafer Characterization 115

6.1 Conductive Versus Insulating Substrates 116

6.2 Probe Pads and Interconnecting Lines 118

6.3 De-embedding the Pads and Interconnects 118

6.3.1 Open 119

6.3.2 Open and Short 122

6.3.3 Open, Short, and Thru 122

6.3.4 Two-Port Network with a Thru 123

6.3.5 Two Shorts, an Open, and a Thru 124

6.3.6 Some Points to Consider When De-embedding 126

6.3.7 Should the Transistor Finger Metal Be De-embedded? 128

6.3.8 Effect of Pad Parasitics on f[subscript T] 129

6.4 De-embedding Pads for Noise 131

6.5 Measuring High-Isolation Devices 134

6.6 Characterizing Vertical Devices 136

6.7 Characterizing Passive Components 138

6.8 Millimeter-Wave Characterization 138

7 RF Test Systems 145

7.1 On-Wafer Noise Testing 145

7.1.1 Basic Concepts in Noise 145

7.1.2 On-Wafer Noise Sources 147

7.1.3 Faraday Shielding 147

7.2 High-Power RF Testing 148

7.3 Characterizing over Temperature 150

7.3.1 Heating the Wafer 152

7.3.2 Cryogenic Cooling 152

8 Package Characterization 157

8.1 Designing a Test Fixture for Package Characterization 158

8.1.1 RF Launchers 158

8.1.2 Coplanar Probes as RF Launchers 159

8.1.3 Test Fixture Body 159

8.2 The Carrier 161

8.2.1 Designing the Carrier 163

8.2.2 Carrier Board Material 164

8.3 Attaching the Package to the Carrier 165

8.3.1 Bond Wires 165

8.3.2 Conductive Adhesives 168

8.4 Calibration 171

8.4.1 Partitioning by Reference Planes 172

8.5 De-embedding the Fixture from the Measurement 174

8.5.1 De-embedding by Using a Thru Line 175

8.5.2 Time-Domain Analysis 176

8.5.3 How to Apply Time-Domain Techniques 180

8.6 Procedure for Characterizing a Package 180

8.6.1 Characterizing with a Thru 182

8.6.2 Characterizing with a Short 183

8.6.3 Characterizing with an Open 183

8.6.4 Characterizing with a Load 183

8.6.5 Characterizing with a PIN Diode 184

8.6.6 What to Do with the Unused Package Pins 186

8.7 Modeling a Package Mounted to a Carrier 186

8.7.1 Ground Inductance 187

8.7.2 Ground Paddle 188

8.8 Designing the Interconnecting Lines on the Carrier 191

8.8.1 CPW or Microstrip 191

8.8.2 CPW or CBCPW 192

8.9 Quantifying the RF Effect of the Package on the Die 193

8.9.1 Effective Relative Dielectric Constant [varepsilon subscript eff] 193

8.9.2 Propagation Constant [gamma] and Characteristic Impedance Z[subscript 0] 193

8.9.3 Loss Tangent tand 195

8.10 Package Styles 196

8.10.1 Plastic Surface Mount Packages 196

8.10.2 Flip-Chip 196

8.10.3 Bumped Chip Carrier 199

9 Future Trends 205

9.1 The Typical Design Cycle 205

9.2 The Separate Worlds of Digital and RF 206

9.3 The Goal: The Marriage of Digital and RF into a Single Wireless Product 207

9.4 New Substrate Materials 208

9.5 The Direction of RF Development 209

9.6 The Future of the RF Test 210.

Notes:

Includes bibliographical references and index.

ISBN:

158053273X

OCLC:

49394999