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Printed circuits handbook / Clyde F. Coombs, Jr., editor in chief.

LIBRA TK7868.P7 P76 2001 1 v. + disc
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Format:
Book
Contributor:
Coombs, Clyde F.
Rosengarten Family Fund.
Series:
McGraw-Hill handbooks
Language:
English
Subjects (All):
Printed circuits--Handbooks, manuals, etc.
Printed circuits.
Genre:
Handbooks and manuals.
Physical Description:
1 volume (various pagings) : illustrations ; 25 cm + 1 computer optical disc (4 3/4 in.)
Edition:
Fifth edition.
Other Title:
Coombs' printed circuits handbook
Place of Publication:
New York : McGraw-Hill, [2001]
System Details:
Minimum system requirements: Windows 95 or later; Adobe Acrobat 5.0 (preferred).
text file
Summary:
Accompanying CD-ROM contains text of book in searchable format.
Contents:
Chapter 1. Electronic Packaging and High-Density Interconnectivity 3
Chapter 2. Semiconductor Packaging Technology 1
Chapter 3. Advanced Packaging 1
Chapter 4. Types of Printed Wiring Boards 1
Part 2 Materials
Chapter 5. Introduction to Base Materials 3
Chapter 6. Base Material Components 1
Chapter 7. Base Material Manufacturing Processes 1
Chapter 8. Properties of Base Materials 1
Chapter 9. Densification Issues for Base Materials 1
Chapter 10. Introducing Base Materials into the PCB Manufacturing Process 1
Chapter 11. HDI Microvia Materials 1
Chapter 12. Laminate Qualification and Testing 1
Part 3 Engineering and Design
Chapter 13. Physical Characteristics of PCB 3
Chapter 14. The PCB Design Process 1
Chapter 15. Electrical and Mechanical Design Parameters 1
Chapter 16. Controlled Impedance 1
Chapter 17. Multilayer Design Issues 1
Chapter 18. Planning for Design, Fabrication, and Assembly 1
Chapter 19. Manufacturing Information Documentation and Transfer 1
Chapter 20. Electronic Contract Manufacturing Supplier Selection and Management 1
Part 4 High-Density Interconnect
Chapter 21. Introduction to High-Density Interconnection Technology 3
Chapter 22. High-Density Interconnect-Build-up Technologies 1
Chapter 23. Microvia Hole Technologies 1
Part 5 Fabrication Processes
Chapter 24. Drilling Processes 3
Chapter 25. High-Density Interconnect Drilling 1
Chapter 26. Imaging 1
Chapter 27. Multilayer Materials and Processing 1
Chapter 28. Preparing Boards for Plating 1
Chapter 29. Electroplating 1
Chapter 30. Direct Plating 1
Chapter 31. PWB Manufacture Using Fully Electroless Copper 1
Chapter 32. Surface Finishes 1
Chapter 33. Etching Process and Technologies 1
Chapter 34. Solder Resist Material and Processes 1
Chapter 35. Machining and Routing 1
Chapter 36. Process Capability and Control 1
Chapter 37. Bare Board Test Objectives and Definitions 1
Chapter 38. Bare Board Test Methods 1
Chapter 39. Bare Board Test Equipment 1
Chapter 40. HDI Bare Board Special Testing Methods 1
Part 6 Assembly
Chapter 41. Assembly Processes 3
Part 7 Soldering
Chapter 42. Design for Soldering and Solderability 3
Chapter 43. Solder Materials and Processes 1
Chapter 44. No-Clean Assembly Process 1
Chapter 45. Lead-Free Soldering 1
Chapter 46. Fluxes and Cleaning 1
Chapter 47. Press-Fit Connections 1
Part 8 Quality Control and Reliability
Chapter 48. Acceptability of Fabricated Boards 3
Chapter 49. Acceptability of Printed Circuit Board Assemblies 1
Chapter 50. Assembly Inspection 1
Chapter 51. Design for Testing 1
Chapter 52. Loaded Board Testing 1
Chapter 53. Reliability of Printed Circuit Assemblies 1
Chapter 54. Component-to-PWB Reliability 1
Part 9 Environmental Issues and Waste Treatment
Chapter 55. Process Waste Minimization and Treatment 3
Part 10 Flexible Circuits
Chapter 56. Flexible Circuits: Applications and Materials 3
Chapter 57. Design of Flexible Circuits 1
Chapter 58. Manufacturing of Flexible Circuits 1
Chapter 59. Termination of Flexible Circuits 1
Chapter 60. Special Constructions of Flexible Circuits 1
Chapter 61. Quality Assurance of Flexible Circuits 1.
Notes:
Includes bibliographical references and index.
Local Notes:
Acquired for the Penn Libraries with assistance from the Rosengarten Family Fund.
ISBN:
0071350160
OCLC:
48049148

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