1 option
Printed circuits handbook / Clyde F. Coombs, Jr., editor in chief.
LIBRA TK7868.P7 P76 2001 1 v. + disc
Available from offsite location
- Format:
- Book
- Series:
- McGraw-Hill handbooks
- Language:
- English
- Subjects (All):
- Printed circuits--Handbooks, manuals, etc.
- Printed circuits.
- Genre:
- Handbooks and manuals.
- Physical Description:
- 1 volume (various pagings) : illustrations ; 25 cm + 1 computer optical disc (4 3/4 in.)
- Edition:
- Fifth edition.
- Other Title:
- Coombs' printed circuits handbook
- Place of Publication:
- New York : McGraw-Hill, [2001]
- System Details:
- Minimum system requirements: Windows 95 or later; Adobe Acrobat 5.0 (preferred).
- text file
- Summary:
- Accompanying CD-ROM contains text of book in searchable format.
- Contents:
- Chapter 1. Electronic Packaging and High-Density Interconnectivity 3
- Chapter 2. Semiconductor Packaging Technology 1
- Chapter 3. Advanced Packaging 1
- Chapter 4. Types of Printed Wiring Boards 1
- Part 2 Materials
- Chapter 5. Introduction to Base Materials 3
- Chapter 6. Base Material Components 1
- Chapter 7. Base Material Manufacturing Processes 1
- Chapter 8. Properties of Base Materials 1
- Chapter 9. Densification Issues for Base Materials 1
- Chapter 10. Introducing Base Materials into the PCB Manufacturing Process 1
- Chapter 11. HDI Microvia Materials 1
- Chapter 12. Laminate Qualification and Testing 1
- Part 3 Engineering and Design
- Chapter 13. Physical Characteristics of PCB 3
- Chapter 14. The PCB Design Process 1
- Chapter 15. Electrical and Mechanical Design Parameters 1
- Chapter 16. Controlled Impedance 1
- Chapter 17. Multilayer Design Issues 1
- Chapter 18. Planning for Design, Fabrication, and Assembly 1
- Chapter 19. Manufacturing Information Documentation and Transfer 1
- Chapter 20. Electronic Contract Manufacturing Supplier Selection and Management 1
- Part 4 High-Density Interconnect
- Chapter 21. Introduction to High-Density Interconnection Technology 3
- Chapter 22. High-Density Interconnect-Build-up Technologies 1
- Chapter 23. Microvia Hole Technologies 1
- Part 5 Fabrication Processes
- Chapter 24. Drilling Processes 3
- Chapter 25. High-Density Interconnect Drilling 1
- Chapter 26. Imaging 1
- Chapter 27. Multilayer Materials and Processing 1
- Chapter 28. Preparing Boards for Plating 1
- Chapter 29. Electroplating 1
- Chapter 30. Direct Plating 1
- Chapter 31. PWB Manufacture Using Fully Electroless Copper 1
- Chapter 32. Surface Finishes 1
- Chapter 33. Etching Process and Technologies 1
- Chapter 34. Solder Resist Material and Processes 1
- Chapter 35. Machining and Routing 1
- Chapter 36. Process Capability and Control 1
- Chapter 37. Bare Board Test Objectives and Definitions 1
- Chapter 38. Bare Board Test Methods 1
- Chapter 39. Bare Board Test Equipment 1
- Chapter 40. HDI Bare Board Special Testing Methods 1
- Part 6 Assembly
- Chapter 41. Assembly Processes 3
- Part 7 Soldering
- Chapter 42. Design for Soldering and Solderability 3
- Chapter 43. Solder Materials and Processes 1
- Chapter 44. No-Clean Assembly Process 1
- Chapter 45. Lead-Free Soldering 1
- Chapter 46. Fluxes and Cleaning 1
- Chapter 47. Press-Fit Connections 1
- Part 8 Quality Control and Reliability
- Chapter 48. Acceptability of Fabricated Boards 3
- Chapter 49. Acceptability of Printed Circuit Board Assemblies 1
- Chapter 50. Assembly Inspection 1
- Chapter 51. Design for Testing 1
- Chapter 52. Loaded Board Testing 1
- Chapter 53. Reliability of Printed Circuit Assemblies 1
- Chapter 54. Component-to-PWB Reliability 1
- Part 9 Environmental Issues and Waste Treatment
- Chapter 55. Process Waste Minimization and Treatment 3
- Part 10 Flexible Circuits
- Chapter 56. Flexible Circuits: Applications and Materials 3
- Chapter 57. Design of Flexible Circuits 1
- Chapter 58. Manufacturing of Flexible Circuits 1
- Chapter 59. Termination of Flexible Circuits 1
- Chapter 60. Special Constructions of Flexible Circuits 1
- Chapter 61. Quality Assurance of Flexible Circuits 1.
- Notes:
- Includes bibliographical references and index.
- Local Notes:
- Acquired for the Penn Libraries with assistance from the Rosengarten Family Fund.
- ISBN:
- 0071350160
- OCLC:
- 48049148
The Penn Libraries is committed to describing library materials using current, accurate, and responsible language. If you discover outdated or inaccurate language, please fill out this feedback form to report it and suggest alternative language.