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Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A. / editors, Shyam P. Murarka ... [and others].
LIBRA TK7870.15 .A333 1998
Available from offsite location
- Format:
- Book
- Series:
- Materials Research Society symposia proceedings ; v. 514.
- Materials Research Society symposia proceedings
- Language:
- English
- Subjects (All):
- Electronic packaging--Materials--Congresses.
- Electronic packaging.
- Electronic packaging--Materials.
- Integrated circuits--Materials--Congresses.
- Integrated circuits.
- Integrated circuits--Materials.
- Semiconductors--Congresses.
- Semiconductors.
- Genre:
- Conference papers and proceedings.
- Physical Description:
- xvi, 560 pages : illustrations ; 24 cm.
- Place of Publication:
- Warrendale, Pa. : Materials Research Society, [1998]
- Notes:
- Includes bibliographical references and indexes.
- ISBN:
- 1558994203
- OCLC:
- 39655352
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