Microelectromechanical structures for materials research : symposium held April 15-16, 1998 , San Francisco, California, U.S.A. / editors, Stuart Brown ... [and others].

Format:

Book

Contributor:

Brown, Stuart B.

Series:

Materials Research Society symposia proceedings ; v. 518.

Materials Research Society symposium proceedings ; v. 518

Language:

English

Subjects (All):

Materials--Research--Equipment and supplies--Congresses.

Materials.

Materials--Research--Equipment and supplies.

Materials--Research.

Microelectromechanical systems--Congresses.

Microelectromechanical systems.

Genre:

Conference papers and proceedings.

Physical Description:

xi, 248 pages : illustrations ; 24 cm.

Place of Publication:

Warrendale, Pa. : Materials Research Society, [1998]

Contents:

Resonance Method: An Attractive Way to Evaluate Mechanical Properties of Thin Gold Films / P. Attia, P. Hesto 3

Transversal Type Piezoelectric Resonator using ZnO Thin Film on Micro-Fabricated ELINVER (Fe-Ni-Cr-Ti) Alloy / Y. Yoshino 9

Multilayer Microelectromechanical Structures For Material Property Characterization / R.I. Pratt, G.C. Johnson 15

The Effects of Texture and Doping on the Young's Modulus of Polysilicon / Sangwoo Lee, Changho Cho, Jongpal Kim, Sangjun Park, Sangwoo Yi, Jongjun Kim, Dong-II Dan Cho 21

Mechanical Property Measurement of 0.5[Mu]m CMOS Microstructures / M.S-C. Lu, X. Zhu, G.K. Fedder 27

Heating Effects on the Young's Modulus of Films Sputtered Onto Micromachined Resonators / H. Kahn, M.A. Huff, A.H. Heuer 33

Measurement of Mechanical Properties in Small Dimensions By Microbeam Deflection / O. Kraft, R. Schwaiger, W.D. Nix 39

Failure of Micron Scale Single Crystal Silicon Bars Due to Torsion Developed By MEMS Micro Instruments / Taher Saif, N.C. MacDonald 45

Young's Modulus, Yield Strength and Fracture Strength of Microelements Determined By Tensile Testing / S. Greek, F. Ericson 51

Round-Robin Tests of Modulus and Strength of Polysilicon / W.N. Sharpe, Jr., S. Brown, G.C. Johnson, W. Knauss 57

Curvature of a Cantilever Beam Subjected to an Equi-Biaxial Bending Moment / P. Krulevitch, G.C. Johnson 67

Meso (Intermediate)-Scale Electromechanical Systems For the Measurement and Control of Sagging in LTCC Structures / Patricio Espinoza-Vallejos, Jihua Zhong, M. Gongora-Rubio, Luis Sola-Laguna, J.J. Santiago-Aviles 73

Observations of Low-Cycle Fatigue of Al Thin Films For MEMS Applications / G. Cornella, R.P. Vinci, R. Suryanarayanan Iyer, R.H. Dauskardt, J.C. Bravman 81

Investigation of the Mechanical Properties and Adhesion of PVD Tungsten Films on Si and Silicon Compounds By Bulge and Blister Tests / Michel Dupeux, Alain Bosseboeuf, Denis Buttard 87

Strength of Surface Micromachined Diaphragms / Xing Yang, Frances M. Siu, Yu-Chong Tai 93

Silicon Oxynitride Membrane For Chemical Sensor Application / S. Astie, E. Scheid, A.M. Gue, J.P. Guillemet, L. Lescouzeres 99

Bulge Test Investigation of the Influence of Moisture on Mechanical Properties of Thin Polymer Layers / A. Nakladal, R. Buchhold, R. Kohler, G. Gerlach, M. Stavrev, C. Wenzel, K. Baumann, B. Nowak 105

A Novel Technique For the Fabrication of Free-Standing Adhesive Films Using a Polymer Template / D.J. Hansford, L.P. Lee, M. Ferrari 111

Test Methods For Characterizing Piezoelectric Thin Films / F.J. von Preissig, H. Zeng, E.S. Kim 117

Silicon Strength Testing For Mesoscale Structural Applications / Kuo-Shen Chen, Arturo A. Ayon, S. Mark Spearing 123

Adhesion of Polysilicon Microbeams in Controlled Humidity Ambients / M.P. de Boer, P.J. Clews, B.K. Smith, T.A. Michalske 131

The Fracture Toughness of Polysilicon Microdevices / R. Ballarini, R.L. Mullen, H. Kahn, A.H. Heuer 137

The Surface Modification with Fluorocarbon Thin Films For the Prevention of Stiction in MEMS / Sang-Ho Lee, Myong-Jong Kwon, Jin-Goo Park, Young-Kweon Kim, Hyung-Jae Shin 143

Adhesion Promotion By Surface-Modification at the PMMA-Metal Interface For LIGA-Type Processing / S.S. Das, C.G. Khan Malek 149

Buckling Evolution of Microelectromechanical Structures / Xin Zhang, Tong-Yi Zhang, Yitshak Zohar 155

MEMS as Temperature Sensors During High-Temperature Processing / H. Tada, A.R. Abramson, P. Nieva, P. Zavracky, I.N. Miaoulis, P.Y. Wong 161

Silicon-Framed Tensile Specimens: Techniques and Results / D.T. Read 167

Mechanical Property Evaluation of Electroplated High Aspect Ratio Microstructures / L.S. Stephens, K.W. Kelly, E.I. Meletis, S. Simhadri 173

Tensile Testing of Ultra-Thin-Film Materials Deposited on Polyimide For MEMS Applications / J.H. Tregilgas, M. Strumpell 179

Mechanical and Metallographic Characterization of LIGA Fabricated Nickel and 80%Ni-20%Fe Permalloy / T.R. Christenson, T.E. Buchheit, D.T. Schmale, R.J. Bourcier 185

Polysilicon Tensile Testing With Electrostatic Gripping / W.N. Sharpe Jr., K. Turner, R.L. Edwards 191

Fracture Strength of Polycrystalline Silicon / P.T. Jones, G.C. Johnson, R.T. Howe 197

Measurement of Elastic Modulus and Poisson's Ratio of Diamond-Like Carbon Films / Sung-Jin Cho, Kwang-Ryeol Lee, Kwang Yong Eun, Dae-Hong Ko 203

Residual Stress of Silicon Films Deposited By LPCVD from Silane / P. Temple-Boyer, E. Imbernon, B. Rousset, E. Scheid 209

Internal Stress of ZnO Thin Films Caused By Thickness Distribution and Crystallinity / M. Takeuchi, K. Inoue, Y. Yoshino, K. Ohwada 215

Finite-Element Modelling of Residual Stress in SiC Diaphragms / Russell G. DeAnna, Christian A. Zorman, Mehran Mehregany 221

Finite-Element Simulations of the Mechanical Stress in and Around Narrow TiSi[subscript 2] Lines / A. Steegen, I. De Wolf, K. Maex, M. Ignat 227

Silicon-Based Epitaxial Films For MEMS / E.A. Fitzgerald, K.C. Wu, M. Currie, N. Gerrish, D. Bruce, J. Borenstein 233

Dopant Mapping and Strain Analysis in B Doped Silicon Structures Using Micro-Raman Spectroscopy / M. Bowden, D.J. Gardiner, M.A. Lourenco, J. Hedley, D. Wood, J.S. Burdess, A.J. Harris 239.

Notes:

Includes bibliographical references and index.

ISBN:

1558994246

OCLC:

40193769