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Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies / John H. Lau, Yi-hsin Pao.
LIBRA TK7874 .L317 1997
Available from offsite location
- Format:
- Book
- Author/Creator:
- Lau, John H.
- Series:
- Electronic packaging and interconnection series
- Language:
- English
- Subjects (All):
- Microelectronic packaging--Reliability.
- Microelectronic packaging.
- Solder and soldering--Testing.
- Solder and soldering.
- Multichip modules (Microelectronics)--Testing.
- Multichip modules (Microelectronics).
- Physical Description:
- xxi, 408 pages : illustrations ; 24 cm.
- Place of Publication:
- New York : McGraw-Hill, [1997]
- Summary:
- This new volume by interconnection expert on solder joints, Johns H. Lau, deals with BGA, CSP, Flip Chips, and other new technologies that underlie the electronics industry's need for smaller, faster products. Naturally, as ever-smaller products are created, the reliability of the solder joints that bind them becomes increasingly crucial. Balancing concepts and practical applications, the authors explain the fundamentals of solder joint reliability and present creative, robust packaging techniques for cost-effective interconnection.
- Notes:
- Includes bibliographical references and index.
- ISBN:
- 0070366489
- OCLC:
- 35043085
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