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Air cooling technology for electronic equipment / edited by Sung Jin Kim, Sang Woo Lee.
LIBRA TK7870.25 .A43 1996
Available from offsite location
- Format:
- Book
- Language:
- English
- Subjects (All):
- Electronic apparatus and appliances--Cooling.
- Electronic apparatus and appliances.
- Electronic packaging--Cooling.
- Electronic packaging.
- Heat--Convection.
- Heat.
- Air flow.
- Physical Description:
- 251 pages : illustrations ; 25 cm
- Place of Publication:
- Boca Raton, Fla. : CRC Press, [1996]
- Summary:
- Clear your bookcase of bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling?
- Notes:
- Includes bibliographical references and index.
- ISBN:
- 0849394473
- OCLC:
- 33359073
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