1 option
Plastic-encapsulated microelectronics : materials, processes, quality, reliability, and applications / edited by Michael G. Pecht, Luu T. Nguyen, Edward B. Hakim.
LIBRA TK7874 .P428 1995
Available from offsite location
- Format:
- Book
- Language:
- English
- Subjects (All):
- Microelectronic packaging--Materials.
- Microelectronic packaging.
- Microencapsulation.
- Plastics in packaging.
- Physical Description:
- xxxiv, 474 pages : illustrations ; 25 cm
- Place of Publication:
- New York : Wiley, [1995]
- Notes:
- "A Wiley-Interscience publication."
- Includes bibliographical references and index.
- ISBN:
- 0471306258
- OCLC:
- 31738522
The Penn Libraries is committed to describing library materials using current, accurate, and responsible language. If you discover outdated or inaccurate language, please fill out this feedback form to report it and suggest alternative language.