Chip on board technologies for multichip modules / edited by John H. Lau.

Format:

Book

Contributor:

Lau, John H.

Language:

English

Subjects (All):

Electronic packaging.

Surface mount technology.

Physical Description:

xviii, 555 pages : illustrations ; 24 cm

Place of Publication:

New York : Van Nostrand Reinhold, [1994]

Summary:

This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.

Notes:

Includes bibliographical references and index.

ISBN:

0442014414

OCLC:

29428811