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Microelectronics packaging handbook / edited by Rao R. Tummala, Eugene J. Rymaszewski ; managing editor Alan G. Klopfenstein.
LIBRA TK7874 .M485 1989
Available from offsite location
- Format:
- Book
- Language:
- English
- Subjects (All):
- Microelectronic packaging--Handbooks, manuals, etc.
- Microelectronic packaging.
- Genre:
- Handbooks and manuals.
- Physical Description:
- xx, 1194 pages : illustrations ; 24 cm
- Place of Publication:
- New York, N.Y. : Van Nostrand Reinhold, [1989]
- Notes:
- Includes bibliographies and index.
- ISBN:
- 0442205783 :
- OCLC:
- 17874010
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